BLM6G10-30 NXP Semiconductors, BLM6G10-30 Datasheet - Page 11

• Manufacturer Part Number: BLM6G10-30
• Description: 30 W LDMOS 2-stage power MMIC for base station applications at frequencies from 860 MHz to 960 MHz
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Fig 14. Package outline SOT822-1
BLM6G10-30_BLM6G10-30G
Product data sheet
HSOP16: plastic, heatsink small outline package; 16 leads
Dimensions
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included
mm
Unit
SOT822-1
Outline
version
(1)
max
nom
min
w
3.6
A
Z
y
1
16
pin 1 index
0.2
A
0
1
e
2
3.5
3.2
A
e
IEC
2
(4×)
(6×)
0.35
b
A
p2
3
D
D
1
−0.06
e
0.06
1
A
e
3
4
(2×)
(2×)
b
p
0.43
0.28
b
JEDEC
(10×)
p
All information provided in this document is subject to legal disclaimers.
b
1.09
0.94
b
p1
p1
12
References
w
(5×)
11
0
5.87
5.72
b
D
Rev. 2 — 1 March 2011
p2
2
w
0.32
0.23
BLM6G10-30; BLM6G10-30G
c
E
1
JEITA
D
16.0
15.8
scale
(1)
5
A
2
13.0
12.6
D
1
A
1
1.1
0.9
D
A
2
4
10 mm
W-CDMA 860 MHz - 960 MHz power MMIC
11.1
10.9
E
(1)
6.2
5.8
E
1
E
H
E
2
E
2.9
2.5
E
2
detail X
European
projection
1.02 1.37
1.5
1.4
Q
e
0.25
e
v
1
0.25
5.69
e
w
A
L
Q
2
p
© NXP B.V. 2011. All rights reserved.
3.81
0.1
X
e
y
3
Issue date
07-02-08
10-10-20
v
θ
14.5
13.9
2.5
2.0
H
sot822-1_po
Z
(A
E
SOT822-1
A
3
)
1.1
0.8
11 of 15
L
8
0
θ
A
p
°
°