BLM6G10-30 NXP Semiconductors, BLM6G10-30 Datasheet - Page 9

• Manufacturer Part Number: BLM6G10-30
• Description: 30 W LDMOS 2-stage power MMIC for base station applications at frequencies from 860 MHz to 960 MHz
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Test information
BLM6G10-30_BLM6G10-30G
Product data sheet
Table 9.
For test circuit see
[1]
Component
C1, C2, C13,
C14
C3, C4, C5,
C11, C12
C6, C9, C10
C7, C8
C15
C16
C17, C18
R1
R2
S1
Fig 12. Component layout for 860 MHz to 960 MHz circuit for 2-carrier W-CDMA
American Technical Ceramics type 100A or capacitor of same quality.
R1
V
GS1
Striplines are on a Rogers 4350B Printed-Circuit Board (PCB) with 
See
List of components
V
Table 9
GS2
R2
Description
multilayer ceramic chip capacitor 4.7 F
multilayer ceramic chip capacitor 100 nF
multilayer ceramic chip capacitor 68 pF
multilayer ceramic chip capacitor 11 pF
multilayer ceramic chip capacitor 6.2 pF
multilayer ceramic chip capacitor 5.1 pF
electrolytic capacitor
SMD resistor
SMD resistor
short
All information provided in this document is subject to legal disclaimers.
C17
Figure
V
V
DS1
for a list of components.
DS1
12.
Rev. 2 — 1 March 2011
C1
C2
BLM6G10-30; BLM6G10-30G
C3
C4
BLM6G1030
BOARD 3 JSH
REV2
C5
C6
W-CDMA 860 MHz - 960 MHz power MMIC
Value
220 F; 63 V
1.5 k
3.3 k
C7
C8
C10
C9
C11
C12
[1]
[1]
[1]
[1]
C13
Remarks
TDK4532X7R1E475Mt020U
Murata X7R or equivalent
piece of copper foil
r
C15
= 3.5; thickness = 0.762 mm.
C14
V
V
C16
DS2
DS2
© NXP B.V. 2011. All rights reserved.
C18
S1
001aan774
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