BLM6G10-30 NXP Semiconductors, BLM6G10-30 Datasheet - Page 15

30 W LDMOS 2-stage power MMIC for base station applications at frequencies from 860 MHz to 960 MHz

BLM6G10-30

Manufacturer Part Number
BLM6G10-30
Description
30 W LDMOS 2-stage power MMIC for base station applications at frequencies from 860 MHz to 960 MHz
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
16. Contents
1
1.1
1.2
2
2.1
2.2
3
4
5
6
7
8
8.1
8.2
8.3
8.4
9
10
11
11.1
12
13
14
14.1
14.2
14.3
14.4
15
16
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 4
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Handling information. . . . . . . . . . . . . . . . . . . . 12
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Moisture sensitivity . . . . . . . . . . . . . . . . . . . . . 12
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ruggedness . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Impedance information . . . . . . . . . . . . . . . . . . . 4
Performance curves . . . . . . . . . . . . . . . . . . . . . 5
Application circuit . . . . . . . . . . . . . . . . . . . . . . . 7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
BLM6G10-30; BLM6G10-30G
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
W-CDMA 860 MHz - 960 MHz power MMIC
Document identifier: BLM6G10-30_BLM6G10-30G
Date of release: 1 March 2011
All rights reserved.

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