MT9VDDF3272G-40B Micron Semiconductor Products, MT9VDDF3272G-40B Datasheet - Page 2
MT9VDDF3272G-40B
Manufacturer Part Number
MT9VDDF3272G-40B
Description
256mb, 512mb X72, Ecc, Sr Pc3200 184-pin Ddr Rdimm
Manufacturer
Micron Semiconductor Products
Datasheet
1.MT9VDDF3272G-40B.pdf
(39 pages)
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Table 1:
Table 2:
pdf: 09005aef80f6ab6a, source: 09005aef80f6ab23
DDAF9C32_64x72_1.fm - Rev. C 7/05 EN
Refresh Count
Row Addressing
Device Bank Addressing
Device Configuration
Column Addressing
Module Rank Addressing
MT9VDDF3272G-40B__
MT9VDDF3272Y-40B__
MT9VDDF6472G-40B__
MT9VDDF6472Y-40B__
Part Number
Address Table
Part Numbers and Timing Parameters
Note:
Module
Density
256MB
256MB
512MB
512MB
All part numbers end with a two-place code (not shown), designating component and
PCB revisions. Consult factory for current revision codes. Example: MT9VDDF3272G-
40BB1.
256MB, 512MB: (x72, ECC, SR) PC3200 184-Pin DDR RDIMM
Configuration
32 Meg x 72
32 Meg x 72
64 Meg x 72
64 Meg x 72
2
256Mb (32 Meg x 8)
4 (BA0, BA1)
8K (A0–A12)
Bandwidth
1K (A0–A9)
Module
256MB
3.2 GB/s
3.2 GB/s
3.2 GB/s
3.2 GB/s
1 (S0#)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
8K
Memory Clock/
5ns/400 MT/s
5ns/400 MT/s
5ns/400 MT/s
5ns/400 MT/s
Data Rate
©2003 Micron Technology, Inc. All rights reserved.
512Mb (64 Meg x 8)
2K (A0–A9, A11)
8K (A0–A12)
4 (BA0, BA1)
512MB
1 (S0#)
(CL -
8K
Latency
t
3-3-3
3-3-3
3-3-3
3-3-3
Features
RCD -
t
RP)
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