MC56F836 Freescale Semiconductor, Inc, MC56F836 Datasheet - Page 141

no-image

MC56F836

Manufacturer Part Number
MC56F836
Description
56f8300 16-bit Digital Signal Controllers
Manufacturer
Freescale Semiconductor, Inc
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC56F8365MFGE
Manufacturer:
Freescale
Quantity:
278
Part Number:
MC56F8365MFGE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC56F8365VFGE
Manufacturer:
Freescale
Quantity:
619
Part Number:
MC56F8365VFGE
Manufacturer:
FREESCALE
Quantity:
125
Part Number:
MC56F8365VFGE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC56F8365VFGE
Manufacturer:
FREESCALE
Quantity:
125
Part Number:
MC56F8366MFV60
Manufacturer:
Power-one
Quantity:
268
Part Number:
MC56F8366MFVE
Manufacturer:
Freescale
Quantity:
440
Part Number:
MC56F8366MFVE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC56F8366MFVE
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MC56F8366VFV60
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MC56F8366VFVE
Manufacturer:
Freescale
Quantity:
43
Part Number:
MC56F8366VFVE
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MC56F8367MPYE
Manufacturer:
FREESCALE
Quantity:
20 000
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p ther-
2. Junction to ambient thermal resistance, Theta-JA (R
3. Junction to case thermal resistance, Theta-JC (R
Freescale Semiconductor
Preliminary
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to case
Junction to center of case
I/O pin power dissipation
Power dissipation
Maximum allowed P
mal test board.
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is
described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when
the package is being used with a heat sink.
ESD for Human Body Model (HBM)
ESD for Machine Model (MM)
ESD for Charge Device Model (CDM)
Characteristic
Table 10-2 56F8365/56F8165 ElectroStatic Discharge (ESD) Protection
D
Characteristic
Table 10-3 Thermal Characteristics
Four layer board (2s2p)
Four layer board (2s2p)
Comments
56F8365 Technical Data, Rev. 7
θJC
θJA
), was simulated to be equivalent to the measured values using the cold
) was simulated to be equivalent to the JEDEC specification JESD51-2
2000
Min
200
500
Symbol
P
R
R
(2s2p)
R
R
R
P
Ψ
DMAX
P
θJMA
θJMA
θJMA
θJA
θJC
JT
I/O
D
Typ
P
D
(TJ - TA) / R
User-determined
= (I
128-pin LQFP
6
DD
Value
50.8
46.5
43.9
41.7
13.9
1.2
x V
Max
DD
θ
+ P
JA
7
I/O
)
General Characteristics
Unit
V
V
V
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
W
W
W
Notes
4, 5
1,2
1,2
2
2
3
141

Related parts for MC56F836