FM23MLD16 Ramtron Corporation, FM23MLD16 Datasheet

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FM23MLD16

Manufacturer Part Number
FM23MLD16
Description
8mbit F-ram Memory
Manufacturer
Ramtron Corporation
Datasheet

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Preliminary
FM23MLD16
8Mbit F-RAM Memory
Features
8Mbit Ferroelectric Nonvolatile RAM
SRAM Compatible
Advanced Features
Description
The FM23MLD16 is a 512Kx16 nonvolatile memory
that reads and writes like a standard SRAM. A
ferroelectric random access memory or F-RAM is
nonvolatile, which means that data is retained after
power is removed. It provides data retention for over
10 years while eliminating the reliability concerns,
functional
complexities of battery-backed SRAM (BBSRAM).
Fast write timing and very high write endurance
make F-RAM superior to other types of memory.
In-system operation of the FM23MLD16 is very
similar to other RAM devices and can be used as a
drop-in replacement for standard SRAM. Read and
write cycles may be triggered by a chip enable or
simply by changing the address. The F-RAM
memory is nonvolatile due to its unique ferroelectric
memory
FM23MLD16
applications requiring frequent or rapid writes in the
form of an SRAM.
The FM23MLD16 includes a low voltage monitor
that blocks access to the memory array when V
drops below a critical threshold.
protected against an inadvertent access and data
corruption under this condition.
The FM23MLD16 F-RAM is available in a 48-ball
FBGA surface mount package. Device specifications
This is a product that has fixed target specifications but are subject
to change pending characterization results.
Rev. 1.0
Dec. 2008
Organized as 512Kx16
Configurable as 1Mx8 Using /UB, /LB
High Endurance 100 Trillion (10
NoDelay™ Writes
Page Mode Operation to 33MHz
Advanced High-Reliability Ferroelectric Process
JEDEC 512Kx16 SRAM Pinout
60 ns Access Time, 115 ns Cycle Time
Low V
Inadvertent Writes
process.
DD
disadvantages,
Monitor Protects Memory against
ideal
These
for
and
nonvolatile
features
14
system
The memory is
) Read/Writes
make
memory
design
the
DD
Superior to Battery-backed SRAM Modules
Low Power Operation
Industry Standard Configuration
are guaranteed over the industrial temperature range
of –40°C to +85°C.
48-Ball FBGA Top View (Ball Down)
FM23MLD16-60-BG
No Battery Concerns
Monolithic Reliability
True Surface Mount Solution, No Rework Steps
Superior for Moisture, Shock, and Vibration
2.7V – 3.6V Power Supply
14 mA Active Current
Industrial Temperature -40 C to +85 C
48-pin “Green”/RoHS FBGA package
C
D
G
H
A
B
E
F
1850 Ramtron Drive, Colorado Springs, CO 80921
DQ14
DQ15
DQ8
DQ9
VSS
VDD
A18
/LB
Ordering Information
1
DQ10
DQ11
DQ12
DQ13
/OE
/UB
NC
A8
2
Ramtron International Corporation
A17
A14
A12
NC
A0
A3
A5
A9
60 ns access, 48-pin
“Green”/RoHS FBGA
3
(800) 545-FRAM, (719) 481-7000
A16
A15
A13
A10
A1
A4
A6
A7
4
http://www.ramtron.com
/CE1
DQ1
DQ3
DQ4
DQ5
/WE
A11
A2
5
DQ0
DQ2
VDD
VSS
DQ6
DQ7
CE2
NC
6
Page 1 of 13

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FM23MLD16 Summary of contents

Page 1

... The FM23MLD16 F-RAM is available in a 48-ball FBGA surface mount package. Device specifications This is a product that has fixed target specifications but are subject to change pending characterization results. ...

Page 2

... Input Write Enable: A write cycle begins when /WE is asserted. The rising edge causes the FM23MLD16 to write the data on the DQ bus to the F-RAM array. The falling edge of /WE latches a new column address for page mode write cycles. /OE Input Output Enable: When /OE is low, the FM23MLD16 drives the data bus when valid read data is available ...

Page 3

... Read; DQ(7:0) Hi Read; DQ(15:8) Hi Read Write; Mask DQ(7: Write; Mask DQ(15: Write Rev. 1.0 Dec. 2008 FM23MLD16 - 512Kx16 FRAM (multi die) A(18:2) A(1:0) Operation X X Standby/Idle Read Change Change Page Mode Read Change V Random Read V V /CE-Controlled Write ...

Page 4

... Rev. 1.0 Dec. 2008 FM23MLD16 - 512Kx16 FRAM (multi die) Write Operation Writes occur in the FM23MLD16 in the same time interval as reads. The FM23MLD16 supports both /CE- and /WE-controlled write cycles. In both cases, the address A(18:2) is latched on the falling edge of /CE1 (while CE2 high) or the rising edge of CE2 (while /CE1 low) ...

Page 5

... It must remain high for at least the minimum precharge time SRAM Drop-In Replacement The FM23MLD16 has been designed drop-in replacement for standard asynchronous SRAMs. The device does not require the CE pins to toggle for each new address. Both CE pins may remain active indefinitely ...

Page 6

... A simple RC circuit may be inserted in the chip enable path to Rev. 1.0 Dec. 2008 FM23MLD16 - 512Kx16 FRAM (multi die) provide some delay and timing margin for the FM23MLD16’s address setup time general rule, the layout designer may need to add series termination resistors to controller outputs that have fast transitions or routes that are > ...

Page 7

... V = 3.6V, /CE1 CE2 < all memory accesses are blocked regardless of input pin conditions Rev. 1.0 Dec. 2008 FM23MLD16 - 512Kx16 FRAM (multi die (JEDEC Std JESD22-A114-D) (JEDEC Std JESD22-C101-C) (JEDEC Std JESD22-A115-A) = 2.7V to 3.6V unless otherwise specified) DD Min 2.7 2.2 2.2 -0.3 2.4 = -1.0 mA ...

Page 8

... Capacitance ( f=1 MHz Symbol Parameter C Input/Output Capacitance I/O C Input Capacitance (/CE1, CE2, A18) IN1 C Input Capacitance (A17-A0, /WE, /OE, /LB, /UB) IN2 Rev. 1.0 Dec. 2008 FM23MLD16 - 512Kx16 FRAM (multi die) = 2.7V to 3.6V unless otherwise specified) DD Min 115 - - 2.7V to 3.6V unless otherwise specified) ...

Page 9

... Input Pulse Levels Input Rise and Fall Times 3 ns Read Cycle Timing 1 (/CE1 low, CE2 high, /OE low) Read Cycle Timing 2 (/CE-controlled) Rev. 1.0 Dec. 2008 FM23MLD16 - 512Kx16 FRAM (multi die) = 2.7V to 3.6V unless otherwise specified) DD min waveform. power ramp profiles. The behavior of the internal circuits is difficult to predict ...

Page 10

... Page Mode Read Cycle Timing 1. Although sequential column addressing is shown not required. Write Cycle Timing 1 (/WE-Controlled, /OE low) CE1 CE2 t AS A(18:0) WE DQ(15:0) Write Cycle Timing 2 (/CE-Controlled) Rev. 1.0 Dec. 2008 FM23MLD16 - 512Kx16 FRAM (multi die WLC ...

Page 11

... Write Cycle Timing 3 (/CE1 low, CE2 high) Page Mode Write Cycle Timing 1. Although sequential column addressing is shown not required. Rev. 1.0 Dec. 2008 FM23MLD16 - 512Kx16 FRAM (multi die) Page ...

Page 12

... LLLLLL= lot code, YY=year, WW=work week LLLLLLL YYWW Examples: FM23MLD16, “Green”/RoHS FBGA package, Lot C8556953BG1, Year 2008, Work Week 44 RAMTRON FM23MLD16-60-BG C8556953BG1 0844 Rev. 1.0 Dec. 2008 FM23MLD16 - 512Kx16 FRAM (multi die 0.75 typ 8.00 BSC 0.40±0.05 6.00 BSC 0.25 Note: All dimensions in millimeters. Bottom View 4 3 ...

Page 13

... Revision History Revision Date 1.0 12/12/2008 Rev. 1.0 Dec. 2008 FM23MLD16 - 512Kx16 FRAM (multi die) Summary Initial release. Page ...

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