adsp-21483 Analog Devices, Inc., adsp-21483 Datasheet - Page 64

• Manufacturer Part Number: adsp-21483
• Description: Sharc Processor
• Manufacturer: Analog Devices, Inc.

ADSP-21483/21486/21487/21488/21489
SURFACE-MOUNT DESIGN
The exposed pad is required to be electrically and thermally
connected to GND. Implement this by soldering the exposed
pad to a GND PCB land that is the same size as the exposed pad.
AUTOMOTIVE PRODUCTS
The ADSP-21488 and ADSP-21489 models are available with
controlled manufacturing to support the quality and reliability
requirements of automotive applications. Note that these Auto-
motive models may have specifications that differ from the
commercial models and designers should review the product
Specifications section of this datasheet carefully. Only the auto-
Table 54. Automotive Products
1
specification which is the only temperature specification.
2
Model
ADSP21488WKBZ3xx
ADSP21489WKBZ3xx
Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see
Z =RoHS Compliant Part.
1.45
1.40
1.35
0.15
0.10
0.05
ROTATED 90° CCW
COPLANARITY
VIEW A
0.08
2
2
1.00 REF
SEATING
PLANE
0.20
0.15
0.09
0.75
0.60
0.45
3.5°
7°
0°
Temperature Range
–40°C to +85°C
–40°C to +85°C
1.60 MAX
Figure 54. 176-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP]
VIEW A
44
1
176
45
Rev. PrA | Page 64 of 66 | March 2010
PIN 1
26.20
26.00 SQ
25.80
COMPLIANT TO JEDEC STANDARDS MS-026-BGA-HD
1
Dimensions shown in millimeters
RAM
3M bit
5M bit
(PINS DOWN)
TOP VIEW
(SW-176-2)
24.10
24.00 SQ
23.90
400 MHz
400 MHz
Processor
Instruction
Rate (Max)
The GND PCB land should be robustly connected to the GND
plane in the PCB for best electrical and thermal performance.
No separate GND pins are provided in the package.
motive grade products shown in
Automotive applications. Contact your local ADI account rep-
resentative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these
models.
133
88
132
89
Operating Conditions on Page 18
132
89
Package Description
100-Lead LQFP_EP
100-Lead LQFP_EP
133
88
Preliminary Technical Data
LEAD PITCH
BSC
0.50
BOTTOM VIEW
21.50 REF
EXPOSED
Table 54
(PINS UP)
PAD
for junction temperature (T
are available for use in
0.27
0.22
0.17
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
“SURFACE MOUNT DESIGN” IN
THIS DATA SHEET.
Package Option
SW-100-2
SW-100-2
176
45
44
1
6.00
REF
J
)