am45dl3208g Advanced Micro Devices, am45dl3208g Datasheet - Page 28

• Manufacturer Part Number: am45dl3208g
• Description: Stacked Multi-chip Package Mcp Flash Memory And Sram
• Manufacturer: Advanced Micro Devices

26
(Word Mode)
Addresses
4Ah
4Bh
4Ch
4Dh
4Eh
40h
41h
42h
43h
44h
45h
46h
47h
48h
49h
4Fh
(Byte Mode)
Addresses
8Ah
8Ch
8Eh
9Ah
9Ch
9Eh
80h
82h
84h
86h
88h
90h
92h
94h
96h
98h
Table 14. Primary Vendor-Specific Extended Query
0050h
0052h
0049h
0031h
0033h
0004h
0002h
0001h
0001h
0004h
0038h
0000h
0000h
0085h
0095h
000xh
Data
P R E L I M I N A R Y
Am45DL3208G
Query-unique ASCII string “PRI”
Major version number, ASCII (reflects modifications to the silicon)
Minor version number, ASCII (reflects modifications to the CFI table)
Address Sensitive Unlock (Bits 1-0)
0 = Required, 1 = Not Required
Silicon Revision Number (Bits 7-2)
Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
Sector Protect
0 = Not Supported, X = Number of sectors in per group
Sector Temporary Unprotect
00 = Not Supported, 01 = Supported
Sector Protect/Unprotect scheme
01 =29F040 mode, 02 = 29F016 mode, 03 = 29F400, 04 = 29LV800
mode
Simultaneous Operation
00 = Not Supported, X = Number of Sectors (excluding Bank 1)
Burst Mode Type
00 = Not Supported, 01 = Supported
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page
ACC (Acceleration) Supply Minimum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
ACC (Acceleration) Supply Maximum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
Top/Bottom Boot Sector Flag
02h = Bottom Boot Device, 03h = Top Boot Device
Description
March 12, 2004