am45dl3208g Advanced Micro Devices, am45dl3208g Datasheet - Page 55
am45dl3208g
Manufacturer Part Number
am45dl3208g
Description
Stacked Multi-chip Package Mcp Flash Memory And Sram
Manufacturer
Advanced Micro Devices
Datasheet
1.AM45DL3208G.pdf
(66 pages)
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FLASH AC CHARACTERISTICS
Alternate CE#f Controlled Erase and Program Operations
Notes:
1. Not 100% tested.
2. See the “Flash Erase And Programming Performance” section for more information.
March 12, 2004
JEDEC
t
t
t
t
WHWH1
WHWH1
WHWH2
t
t
t
t
t
t
t
t
t
EHWH
AVWL
DVEH
EHDX
GHEL
WLEL
AVAV
ELAX
ELEH
EHEL
Parameter
t
t
t
WHWH1
WHWH1
WHWH2
t
t
Std
GHEL
t
t
t
t
t
t
t
t
CPH
WC
WS
WH
AS
AH
DS
DH
CP
Description
Write Cycle Time (Note 1)
Address Setup Time
Address Hold Time
Data Setup Time
Data Hold Time
Read Recovery Time Before Write
(OE# High to WE# Low)
WE# Setup Time
WE# Hold Time
CE#f Pulse Width
CE#f Pulse Width High
Programming Operation
(Note 2)
Accelerated Programming Operation,
Word or Byte (Note 2)
Sector Erase Operation (Note 2)
P R E L I M I N A R Y
Am45DL3208G
Word
Byte
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Typ
Typ
Typ
Typ
70
70
40
40
40
Speed
0.4
30
0
0
0
0
0
5
7
4
85
85
45
45
45
Unit
sec
53
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
µs
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