AM29LV2562M AMD [Advanced Micro Devices], AM29LV2562M Datasheet - Page 65

• Manufacturer Part Number: AM29LV2562M
• Manufacturer: AMD [Advanced Micro Devices]

PHYSICAL DIMENSIONS
LSC080–80-Ball Fortified Ball Grid Array
18 x 12 mm Package
December 16, 2005
PACKAGE
SYMBOL
SD / SE
JEDEC
CORNER
A
D x E
MD
ME
A1
A2
D1
E1
eE
eD
PIN A1
φb
A
D
E
n
0.20
(2X)
A2
A1
C
MIN
0.40
1.00
0.50
---
18.00 mm x 12.00 mm
INDEX MARK
80X
10
18.00 BSC.
12.00 BSC.
PACKAGE
9.00 BSC.
7.00 BSC.
1.00 BSC.
0.50 BSC.
1.00 BSC
0.25 M C
0.10
LSC 080
NOM
6
0.60
N/A
---
---
---
10
80
b
8
M C
A B
TOP VIEW
MAX
1.60
1.11
0.70
---
SIDE VIEW
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
D A T A S H E E T
Am29LV2562M
C
0.20
A
(2X)
E
B
C
eE
0.25 C
0.20
8
7
6
5
4
3
2
1
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
eD
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
K
J
BOTTOM VIEW
SD
7
H
G
F
D1
E
D
C
B
A
SE
CORNER
PIN A1
3266 \ 16-038.15a
7
E1
63