AM29LV2562M AMD [Advanced Micro Devices], AM29LV2562M Datasheet - Page 8

• Manufacturer Part Number: AM29LV2562M
• Manufacturer: AMD [Advanced Micro Devices]

CONNECTION DIAGRAMS
Note: The FBGA package pinout configuration shown is preliminary. The ball count and package physical dimensions have not
yet been determined. Contact AMD for further information.
Special Package Handling Instructions
Special handling is required for Flash Memory products
in molded packages (BGA). The package and/or data
integrity may be compromised if the package body is
6
DQ23/A-1
DQ31/A-1
DQ21
DQ30
DQ18
RFU
A5
A4
V
A3
A2
A1
V
A8
A7
A6
CC
SS
RY/BY#
DQ28
DQ16
WE#
A13
A9
A7
A3
B8
B7
B6
B5
B4
B3
B2
B1
WP#/ACC
RESET#
A22
A12
A17
V
C8
C7
C6
A8
C5
C4
C3
C2
A4
C1
CC
RFU
A23
A14
A10
A21
A18
D8
D7
D6
D5
D4
D3
A6
D2
A2
D1
Top View, Balls Facing Down
D A T A S H E E T
80-ball Fortified BGA
Am29LV2562M
RFU
A15
A11
A19
A20
V
E8
E7
E6
E5
E4
E3
A5
E2
A1
E1
IO
DQ7
DQ5
DQ2
DQ0
RFU
A16
V
A0
F8
F7
F6
F5
F4
F3
F2
F1
exposed to temperatures above 150°C for prolonged
periods of time.
SS
WORD#
DQ14
DQ12
DQ10
DQ8
CE#
RFU
V
G8
G7
G6
G5
G4
G3
G2
G1
IO
DQ15
DQ13
DQ11
RFU
DQ9
RFU
OE#
V
H8
H7
H6
H5
H4
H3
H2
H1
CC
DQ29
DQ24
DQ6
DQ4
DQ3
DQ1
V
V
J8
J7
J6
J5
J4
J3
J2
J1
SS
SS
December 16, 2005
DQ22
DQ20
DQ27
DQ26
DQ19
DQ17
DQ25
V
K8
K7
K6
K5
K4
K3
K2
K1
CC