LPC1114FHN33/302 NXP Semiconductors, LPC1114FHN33/302 Datasheet - Page 104
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LPC1114FHN33/302
Manufacturer Part Number
LPC1114FHN33/302
Description
ARM Microcontrollers - MCU 32b 32K Flash 42I/O
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1114FHN33/302
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1114
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
32 KB
Data Ram Size
8 KB
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, SSP, UART
Maximum Operating Temperature
+ 85 C
Number Of Programmable I/os
42
Number Of Timers
4
Program Memory Type
Flash
Factory Pack Quantity
260
Tradename
LPC1100L
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1114FHN33/302
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
LPC1114FHN33/302:5
Manufacturer:
Intersil
Quantity:
419
Part Number:
LPC1114FHN33/302:5
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
LPC111X
Product data sheet
Fig 61. Reflow soldering of the HVQFN24 package
Footprint information for reflow soldering of HVQFN24 package
Dimensions in mm
Issue date
0.500
P
5.000
Ax
07-05-07
09-06-15
Hy
5.000
Ay
solder land
solder paste deposit
solder land plus solder paste
occupied area
Gy
(0.105)
3.200
Bx
3.200
By
0.900
C
C
D
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
0.240
D
nSPy
Rev. 8 — 20 February 2013
2.500
SLx
Generic footprint pattern
nSPx
2.500
P
SLy
SPx tot
SLx
Hx
Gx
Bx
Ax
SPx tot
1.500
LPC1110/11/12/13/14/15
SPx
SPy tot
SPy
1.500
32-bit ARM Cortex-M0 microcontroller
0.025
0.550
SPx
0.550
SPy
4.300
Gx
0.025
SLy
4.300
Gy
By
© NXP B.V. 2013. All rights reserved.
Ay
5.250
nSPx
Hx
2
sot616-3_fr
SOT616-3
5.250
104 of 114
nSPy
Hy
2