LPC1114FHN33/302 NXP Semiconductors, LPC1114FHN33/302 Datasheet - Page 98
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LPC1114FHN33/302
Manufacturer Part Number
LPC1114FHN33/302
Description
ARM Microcontrollers - MCU 32b 32K Flash 42I/O
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1114FHN33/302
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1114
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
32 KB
Data Ram Size
8 KB
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, SSP, UART
Maximum Operating Temperature
+ 85 C
Number Of Programmable I/os
42
Number Of Timers
4
Program Memory Type
Flash
Factory Pack Quantity
260
Tradename
LPC1100L
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1114FHN33/302
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
LPC1114FHN33/302:5
Manufacturer:
Intersil
Quantity:
419
Part Number:
LPC1114FHN33/302:5
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
Fig 55. Package outline (HVQFN33 7x7)
LPC111X
Product data sheet
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 x 7 x 0.85 mm
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
mm
Unit
Outline
version
max
nom
min
terminal 1
index area
terminal 1
index area
1.00
0.85
0.80
A
(1)
E
0.05
0.02
0.00
L
A
h
1
8
1
0.35
0.28
0.23
b
IEC
9
32
0.2
c
e
D
7.1
7.0
6.9
(1)
33
D
4.85
4.70
4.55
e
D
D
JEDEC
1
h
h
All information provided in this document is subject to legal disclaimers.
E
7.1
7.0
6.9
(1)
b
References
Rev. 8 — 20 February 2013
4.85
4.70
4.55
0
25
E
h
16
0.65 4.55
e
JEITA
17
24
- - -
w
v
scale
B
e
e
2.5
1
C
C
e
A
E
4.55
2
A
e
2
B
LPC1110/11/12/13/14/15
0.75
0.60
0.45
L
A
5 mm
A
0.1
v
1
32-bit ARM Cortex-M0 microcontroller
0.05
w
y
1
0.08
C
y
detail X
European
projection
0.1
y
1
C
X
y
© NXP B.V. 2013. All rights reserved.
Issue date
09-03-17
09-03-23
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hvqfn33_po
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