LPC1114FHN33/302 NXP Semiconductors, LPC1114FHN33/302 Datasheet - Page 3
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LPC1114FHN33/302
Manufacturer Part Number
LPC1114FHN33/302
Description
ARM Microcontrollers - MCU 32b 32K Flash 42I/O
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1114FHN33/302
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1114
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
32 KB
Data Ram Size
8 KB
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, SSP, UART
Maximum Operating Temperature
+ 85 C
Number Of Programmable I/os
42
Number Of Timers
4
Program Memory Type
Flash
Factory Pack Quantity
260
Tradename
LPC1100L
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1114FHN33/302
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
LPC1114FHN33/302:5
Manufacturer:
Intersil
Quantity:
419
Part Number:
LPC1114FHN33/302:5
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
LPC111X
Product data sheet
Type number
SO20, TSSOP20, TSSOP28, and DIP28 packages
LPC1110FD20
LPC1111FDH20/002
LPC1112FD20/102
LPC1112FDH20/102
LPC1112FDH28/102
LPC1114FDH28/102
LPC1114FN28/102
HVQFN24/33 and LQFP48 packages
LPC1111FHN33/101
LPC1111FHN33/102
LPC1111FHN33/201
LPC1111FHN33/202
LPC1111FHN33/103
LPC1111FHN33/203
LPC1112FHN33/101
LPC1112FHN33/102
LPC1112FHN33/201
LPC1112FHN33/202
LPC1112FHN24/202
LPC1112FHI33/202
Ordering information
[1]
[1]
[1]
Package
Name
SO20
TSSOP20
SO20
TSSOP20
TSSOP28
TSSOP28
DIP28
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN24
HVQFN33
eMetering
Alarm systems
Description
SO20: plastic small outline package; 20 leads; body width 7.5 mm
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SO20: plastic small outline package; 20 leads; body width 7.5 mm
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
DIP28: plastic dual in-line package; 28 leads (600 mil)
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN24: plastic thermal enhanced very thin quad flat package; no
leads; 24 terminals; body 4 x 4 x 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5 5 0.85 mm
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 20 February 2013
LPC1110/11/12/13/14/15
Lighting
White goods
32-bit ARM Cortex-M0 microcontroller
© NXP B.V. 2013. All rights reserved.
Version
SOT163-1
SOT360-1
SOT163-1
SOT360-1
SOT361-1
SOT361-1
SOT117-1
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
SOT616-3
n/a
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