LPC1114FHN33/302 NXP Semiconductors, LPC1114FHN33/302 Datasheet - Page 97
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LPC1114FHN33/302
Manufacturer Part Number
LPC1114FHN33/302
Description
ARM Microcontrollers - MCU 32b 32K Flash 42I/O
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1114FHN33/302
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1114
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
32 KB
Data Ram Size
8 KB
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, SSP, UART
Maximum Operating Temperature
+ 85 C
Number Of Programmable I/os
42
Number Of Timers
4
Program Memory Type
Flash
Factory Pack Quantity
260
Tradename
LPC1100L
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1114FHN33/302
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
LPC1114FHN33/302:5
Manufacturer:
Intersil
Quantity:
419
Part Number:
LPC1114FHN33/302:5
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
Fig 54. Package outline (HVQFN33 5x5)
LPC111X
Product data sheet
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
mm
Unit
Outline
version
(1)
max
nom
min
terminal 1
index area
terminal 1
index area
0.85
A
L
(1)
E h
0.05
0.00
8
1
A
1
32
0.30
0.18
9
b
IEC
e
0.2
c
D
5.1
4.9
(1)
D h
e 1
D
3.75
3.45
1/2 e
D
MO-220
JEDEC
h
All information provided in this document is subject to legal disclaimers.
E
5.1
4.9
b
(1)
0
References
Rev. 8 — 20 February 2013
3.75
3.45
E
25
16
h
0.5
17
24
e
JEITA
B
1/2 e
e
scale
3.5
e
w
2.5
v
A
E
1
e 2
3.5
e
C
C
2
A
LPC1110/11/12/13/14/15
0.5
0.3
B
L
0.1
v
5 mm
A
32-bit ARM Cortex-M0 microcontroller
0.05
w
y 1 C
A 1
0.05
y
European
projection
0.1
detail X
y
1
X
C
y
© NXP B.V. 2013. All rights reserved.
Issue date
11-10-11
11-10-17
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hvqfn33f_po
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