ADP5585CP-EVALZ Analog Devices, ADP5585CP-EVALZ Datasheet - Page 37

• Manufacturer Part Number: ADP5585CP-EVALZ
• Description: Interface Development Tools LFCSP Evaluation Board
• Manufacturer: Analog Devices
• Series: ADP5585r

Specifications of ADP5585CP-EVALZ

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: ADP5585
• Interface Type: I2C
• Operating Supply Voltage: 1.8 V to 3 V
• Factory Pack Quantity: 1

Data Sheet
OUTLINE DIMENSIONS
IDENTIFIER
INDICATOR
SE ATING
SEATING
0.545
0.500
0.455
BALL A1
PLANE
PLANE
0.80
0.75
0.70
PIN 1
Figure 29. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
(BALL SIDE DOWN)
Figure 28. 16-Ball Wafer Level Chip Scale Package [WLCSP]
TOP VIEW
TOP VIEW
1.630
1.590 SQ
1.550
SIDE VIEW
3.10
3.00 SQ
2.90
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
0.300
0.260
0.220
3 x 3 mm Body, Very Very Thin Quad
Dimensions shown in millimeters
Dimensions shown in millimeters
Rev. C | Page 37 of 40
0.20 REF
(CB-16-10)
(CP-16-22)
0.50
0.40
0.30
BSC
0.50
0.05 MAX
0.02 NOM
COPLANARITY
0.05
COPLANARITY
0.230
0.200
0.170
REF
0.40
1.20
REF
0.08
12
9
0.30
0.23
0.18
13
8
BOTTOM VIEW
EXPOSED
PAD
4
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
(BALL SIDE UP)
3
16
5
1
4
2
0.25 MIN
1
1.75
1.60 SQ
1.45
B
C
D
A
ADP5585