MT48LC64M8A2P-75:C Micron Technology Inc, MT48LC64M8A2P-75:C Datasheet - Page 43
![IC SDRAM 512MBIT 133MHZ 54TSOP](/photos/7/22/72261/557-54-tsop_sml.jpg)
MT48LC64M8A2P-75:C
Manufacturer Part Number
MT48LC64M8A2P-75:C
Description
IC SDRAM 512MBIT 133MHZ 54TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC64M8A2TG-75C_TR.pdf
(68 pages)
Specifications of MT48LC64M8A2P-75:C
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
512M (64M x 8)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP II
Organization
64Mx8
Density
512Mb
Address Bus
15b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
115mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT48LC64M8A2P-75:C
Manufacturer:
MITSUBISHI
Quantity:
450
Table 11:
Table 12:
Figure 32:
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
Parameter
Operating case temperature:
Commercial
Junction temperature:
Commercial
Industrial
Ambient temperature:
Commercial
Industrial
Peak reflow temperature
Industrial
Die Size
(mm
94
2
)
Temperature Limits
Summary of Thermal Impedance
Package
Example Temperature Test Point Location, 54-Pin TSOP: Top View
TSOP
Notes:
Number of
1. MAX operating case temperature, T
2. Device functionality is not guaranteed if the device exceeds maximum T
3. Both temperature specifications must be satisfied.
4. The case temperature should be measured by gluing a thermocouple to the top center of
5. Operating ambient temperature surrounding the package.
Test point
Leads
54
side of the device, as shown on page 47.
the component. This should be done with a 1mm bead of conductive epoxy, as defined by
the JEDEC EIA/JESD51 standards. Care should be taken to ensure the thermocouple bead is
touching the case.
2-layer
4-layer
Board
Test
11.11mm
43
(°C/W)
0m/s
62.6
39.2
θ
JA
22.22mm
Symbol
C
, is measured in the center of the package on the top
T
PEAK
T
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T
T
A
C
J
(°C/W)
θ
1m/s
48.4
32.3
JMA
Min
–40
–40
–40
0
0
0
–
512Mb: x4, x8, x16 SDRAM
(°C/W)
θ
2m/s
Electrical Specifications
44.2
30.6
JMA
Max
260
80
90
85
95
70
85
©2000 Micron Technology, Inc. All rights reserved.
5.08mm
(°C/W)
19.2
19.3
θ
Units
C
JB
°C
°C
°C
°C
during operation.
10.16mm
1, 2, 3, 4
(°C/W)
Notes
θ
6.7
3, 5
JC
3