TLP550 Toshiba, TLP550 Datasheet - Page 21

PHOTOCOUPLER HS TRANS-OUT 8DIP

TLP550

Manufacturer Part Number
TLP550
Description
PHOTOCOUPLER HS TRANS-OUT 8DIP
Manufacturer
Toshiba
Datasheets

Specifications of TLP550

Number Of Channels
1
Input Type
DC
Voltage - Isolation
2500Vrms
Current Transfer Ratio (min)
10% @ 16mA
Voltage - Output
15V
Current - Output / Channel
8mA
Current - Dc Forward (if)
25mA
Output Type
Transistor with Base
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Vce Saturation (max)
-
Current Transfer Ratio (max)
-
Other names
TLP550(Y)
TLP5500

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TLP550
Manufacturer:
TOS
Quantity:
16 920
Part Number:
TLP550
Manufacturer:
TOSHIBA
Quantity:
1 000
Part Number:
TLP550
Manufacturer:
TOSHIBA
Quantity:
1 000
Part Number:
TLP550
Manufacturer:
ST
0
Part Number:
TLP550
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
TLP550(F)
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
TLP550(F)
0
Part Number:
TLP550G
Manufacturer:
MCL
Quantity:
2
Part Number:
TLP550G
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
TLP550GP
Manufacturer:
XILINX
Quantity:
120
Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.) (Continued)
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.)
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
TLP2105
TLP2108
TLP2200
TLP109
TLP2409
TLP512
TLP550
TLP551
TLP2403
TLP553
TLP559
TLP651
TLP719
TLP719F
Part Number
Part Number
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
TÜV and VDE: : Approved
For the latest information, please contact your nearest Toshiba sales representative.
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
EN 60747-5-2-approved with option V4 or D4
Pin Configuration
Pin Configuration
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
6
1
6
1
6
1
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
5
5
2
5
2
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
: Design which meets safety standard/approval pending as of January 2011
4
3
3
4
4
3
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
SO6 (reinforced insulation)
SO8
Topr = 125˚C(max)
SO8 version of the TLP109
DIP6
6-pin package version
of the TLP550
DIP8
High CMR
DIP8
Internal base connection
SO8
Low input current
SO8 version of the TLP553
DIP8
Low input drive current
DIP8
High CMR version
of the TLP550
DIP8
Internal base connection
SDIP6
High CMR
SO8
Dual-channel version for
the TLP105
V
SO8
Dual-channel version for
the TLP108
V
DIP8
Low input current
V
CC
CC
CC
= 4.5 to 20 V
= 4.5 to 20 V
= 4.5 to 20 V
Features
Features
: Approved (reinforced insulation)
(NRZ) (Typ.)
Propagation
Delay Time
Data Rate
300 kbit/s
300 kbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
250 ns
250 ns
400 ns
(Max)
21
(19% min for rank 0)
(19% min for rank 0)
(19% min for rank 0)
(Inverter logic)
(Buffer logic)
(Buffer logic)
Output Form
Totem pole
Totem pole
400%
400%
20% (min)
20%
20%
20%
10%
10%
10%
20%
3-state
output
output
CTR
: Design which meets safety standard/approval pending as of January 2011
(min)
(min)
(min)
(min)
(min)
(min)
(min)
(min)
(min)
1.6 mA
1.6 mA
1.6 mA
0.5 mA
16 mA
16 mA
0.5 mA
16 mA
16 mA
16 mA
16 mA
16 mA
16 mA
(Max)
I
I
@I
FHL
FLH
F
,
Vrms
Vrms
Vrms
Vrms
Vrms
3750
3750
2500
3750
Vrms
3750
2500
Vrms
2500
Vrms
2500
Vrms
3750
2500
Vrms
2500
Vrms
5000
Vrms
5000
Vrms
BVs
BVs
UL/cUL TÜV
UL/cUL TÜV
/
/
/
/
/
/
/
/
/
/
/ –
/
/ –
Safety Standards
Safety Standards
VDE
VDE
(1)
(1)
(1)
(1)
(1)
BSI
BSI
(2)
(2)
IEC
IEC

Related parts for TLP550