TLP550 Toshiba, TLP550 Datasheet - Page 56

• Manufacturer Part Number: TLP550
• Description: PHOTOCOUPLER HS TRANS-OUT 8DIP
• Manufacturer: Toshiba

Specifications of TLP550

• Number Of Channels: 1
• Input Type: DC
• Voltage - Isolation: 2500Vrms
• Current Transfer Ratio (min): 10% @ 16mA
• Voltage - Output: 15V
• Current - Output / Channel: 8mA
• Current - Dc Forward (if): 25mA
• Output Type: Transistor with Base
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Vce Saturation (max): -
• Current Transfer Ratio (max): -
• Other names: TLP550(Y); TLP5500

8
Below are the example land patterns for surface-mount packages.
Surface-Mount Lead-Formed Photocouplers
Mini-flat and SOP couplers
Example:
1
MFSOP6 (4-Pin) [e.g., TLP181]
(LF1)&(LF5) [e.g., TLP734(LF1)]
SO6 (4-Pin) [e.g., TLP265J]
2.54SOP4 [e.g., TLP197G]
Board Assembly
For the example land patterns for the TLP781, see its datasheet.
Example Land Patterns
1.5
6-pin DIP package
0.8
2.54
2.54
2.54
SO8 [e.g., TLP2105]
1.27
1.27
MFSOP6 (5-Pin) [e.g., TLP114A]
(LF4) [e.g., TLP734(LF4)]
1.5
1.27
0.8
2.54
0.8
1.27
2.54
1.27
2.54
Unit: mm
56
SOP4 [e.g., TLP280]
Example:
0.8
1.27
SDIP6 [e.g., TLP719]
6-pin SDIP package
0.8
1.27 1.27
SO6 (5-Pin) [e.g., TLP109]
1.27
2.54
SSOP4 [e.g., TLP3213]
1.27
SDIP6 (F type) [e.g., TLP719F]
0.8
3.73
0.8
1.27 1.27
0.95
Unit: mm
Unit: mm