MPC8544DS Freescale Semiconductor, MPC8544DS Datasheet - Page 81
![BOARD DEVELOPMENT SYSTEM 8544](/photos/37/58/375876/mpc8544e_sml.jpg)
MPC8544DS
Manufacturer Part Number
MPC8544DS
Description
BOARD DEVELOPMENT SYSTEM 8544
Manufacturer
Freescale Semiconductor
Series
PowerQUICC III™r
Type
MPUr
Datasheets
1.MPC8544VTALF.pdf
(117 pages)
2.MPC8544VTALF.pdf
(2 pages)
3.MPC8544VTALF.pdf
(1340 pages)
4.MPC8544DS.pdf
(2 pages)
Specifications of MPC8544DS
Contents
Board
Processor To Be Evaluated
MPC8544E
Data Bus Width
32 bit
Interface Type
Ethernet, I2C
Operating Supply Voltage
- 0.3 V to + 1.1 V
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
For Use With/related Products
MPC8544
For Use With
PPC8544EVTANG - EVAL MPC8544 783FCPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- MPC8544VTALF PDF datasheet
- MPC8544VTALF PDF datasheet #2
- MPC8544VTALF PDF datasheet #3
- MPC8544DS PDF datasheet #4
- Current page: 81 of 117
- Download datasheet (2Mb)
18 Package Description
This section details package parameters, pin assignments, and dimensions.
18.1
The package parameters for flip chip plastic ball grid array (FC-PBGA) are provided in
Freescale Semiconductor
Package Parameters for the MPC8544E FC-PBGA
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Package outline
Interconnects
Ball pitch
Ball diameter (typical)
Solder ball (Pb-free)
Note:
1. (FC-PBGA) without a lid.
Table 61. Package Parameters
Parameter
29 mm × 29 mm
96.5% Sn
3.5% Ag
PBGA
0.6 mm
1 mm
783
1
Table
Package Description
61.
81
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