DSPIC30F6014-30I/PF Microchip Technology, DSPIC30F6014-30I/PF Datasheet - Page 190

• Manufacturer Part Number: DSPIC30F6014-30I/PF
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6014-30I/PF

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 144KB (48K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TQFP, 80-VQFP
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 68
• Flash Memory Size: 144KB
• Supply Voltage Range: 2.5V To 5.5V
• Package: 80TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 68
• Interface Type: 3-Wire/AC97/CAN/I2C/I2S/SPI/UART
• On-chip Adc: 16-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1DM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC164314 - MODULE SKT FOR PM3 80PFAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F601430IPF

dsPIC30F6011/6012/6013/6014
TABLE 23-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
FIGURE 23-7:
TABLE 23-22: BAND GAP START-UP TIME REQUIREMENTS
DS70117F-page 188
AC CHARACTERISTICS
SY25
SY30
SY35
Note 1:
AC CHARACTERISTICS
SY40
Note 1:
Param
Param
(see Note)
Note: Set LVDEN bit (RCON<12>) or the BOREN bit (FBORPOR<7>).
Enable Band Gap
No.
No.
2:
3:
2:
T
T
T
Symbol
T
OST
Symbol
BOR
FSCM
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
Refer to Figure 23-2 and Table 23-11 for BOR.
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
BGAP
0V
AND BROWN-OUT RESET TIMING REQUIREMENTS
Brown-out Reset Pulse Width
Oscillation Start-up Timer Period
Fail-Safe Clock Monitor Delay
Band Gap Start-up Time
BAND GAP START-UP TIME CHARACTERISTICS
Characteristic
Characteristic
(1)
(1)
SY40
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
Min
(3)
—
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
Min
Typ
100
—
—
40
(2)
1024 T
Typ
Max
500
65
—
(2)
OSC
Units
-40°C
-40°C
µs
Max
900
—
—
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable.
RCON<13>Status bit
-40°C T
-40°C T
T
T
A
A
Units
—
s
s
+85°C for Industrial
+125°C for Extended
© 2006 Microchip Technology Inc.
A
A
V
T
-40°C to +85°C
OSC
Conditions
DD
+85°C for Industrial
+125°C for Extended
= OSC1 period
V
Conditions
BOR
(D034)
V
BGAP
Band Gap
Stable