HD6473228F10V Renesas Electronics America, HD6473228F10V Datasheet - Page 10

• Manufacturer Part Number: HD6473228F10V
• Description: MCU 5V 32K,PB-FREE 64-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/325r

Specifications of HD6473228F10V

• Core Processor: H8/300
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: SCI, UART/USART
• Number Of I /o: 53
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: OTP
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 64-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Peripherals: -

Appendices
Appendix A. CPU Instruction Set
...................................................................................... 257
A.1 Instruction Set List................................................................................................................ 257
A.2 Operation Code Map............................................................................................................. 264
A.3 Number of States Required for Execution............................................................................ 266
Appendix B. Register Field
................................................................................................. 272
B.1 Register Addresses and Bit Names....................................................................................... 272
B.2 Register Descriptions............................................................................................................ 276
Appendix C. Pin States
......................................................................................................... 301
C.1 Pin States in Each Mode ....................................................................................................... 301
Appendix D. Timing of Transition to and Recovery from Hardware
Standby Mode ..................................................................................
303
Appendix E. Package Dimensions
.................................................................................... 304
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