HD6417032F20V Renesas Electronics America, HD6417032F20V Datasheet - Page 234

SH1 ROMLESS LEAD FREE

HD6417032F20V

Manufacturer Part Number
HD6417032F20V
Description
SH1 ROMLESS LEAD FREE
Manufacturer
Renesas Electronics America
Series
SuperH® SH7030r
Datasheet

Specifications of HD6417032F20V

Core Processor
SH-1
Core Size
32-Bit
Speed
20MHz
Connectivity
EBI/EMI, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
32
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417032F20V
Manufacturer:
TI
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Part Number:
HD6417032F20V
Manufacturer:
RENESAS
Quantity:
20
Section 9 Direct Memory Access Controller (DMAC)
Relationship between Request Modes and Bus Modes by DMA Transfer Category: Table 9.6
shows the relationship between request modes and bus modes by DMA transfer category.
Rev. 7.00 Jan 31, 2006 page 206 of 658
REJ09B0272-0700
Bus cycle
Burst Mode
Once the bus is obtained, the transfer is performed continuously until the transfer end
condition is satisfied. In external request mode with low-level detection at the DREQ pin,
however, when the DREQ pin is driven high, the bus passes to the other bus master after the
bus cycle of the DMAC that currently has an acknowledged request ends, even if the transfer
end conditions have not been satisfied.
Burst mode cannot be used when the serial communication interface (SCI) is the transfer
request source. Figure 9.11 shows an example of DMA transfer timing in burst mode. The
transfer conditions shown in the figure are:
DREQ
Figure 9.11 Transfer Example in Burst Mode (Single Address Mode, DREQ
Single address mode
DREQ level detection
CPU
CPU
CPU
DMAC DMAC DMAC DMAC DMAC
Detection)
DMAC
DREQ Level
DREQ
DREQ
CPU

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