UPD78F0533AGB-GAH-AX Renesas Electronics America, UPD78F0533AGB-GAH-AX Datasheet - Page 913

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UPD78F0533AGB-GAH-AX

Manufacturer Part Number
UPD78F0533AGB-GAH-AX
Description
MCU 8BIT 64-LQFP
Manufacturer
Renesas Electronics America
Series
78K0/Kx2r
Datasheet

Specifications of UPD78F0533AGB-GAH-AX

Core Processor
78K/0
Core Size
8-Bit
Speed
20MHz
Connectivity
3-Wire SIO, I²C, LIN, UART/USART
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
55
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD78F0533AGB-GAH-AX
Manufacturer:
RENESAS
Quantity:
460
Part Number:
UPD78F0533AGB-GAH-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
78K0/Kx2
Note
Caution
R01UH0008EJ0401 Rev.4.01
Jul 15, 2010
Infrared reflow
Partial heating
Soldering Method
(2) 30-pin plastic SSOP (7.62 mm (300))
Table 35-1. Soldering Conditions of Conventional-specification Products (
44-pin plastic LQFP (10x10)
48-pin plastic LQFP (fine pitch) (7x7)
52-pin plastic LQFP (10x10)
64-pin plastic LQFP (fine pitch) (10x10)
64-pin plastic LQFP (14x14)
64-pin plastic LQFP (12x12)
64-pin plastic TQFP (fine pitch) (7x7)
80-pin plastic LQFP (14x14)
80-pin plastic LQFP (fine pitch) (12x12)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
PD78F050xMC-5A4-A (x = 0 to 3), 78F0503DMC-5A4-A
PD78F051xGB-UES-A (x = 1 to 3), 78F0513DGB-UES-A
PD78F051xGA-8EU-A (x = 1 to 5), 78F0515DGA-8EU-A
PD78F051xGA(A)-GAM-AX (x = 1 to 5), 78F051xGA(A2)-GAM-AX (x = 1 to 5)
PD78F052xGB-UET-A (x = 1 to 7), 78F0527DGB-UET-A
PD78F053xGB-UEU-A (x = 1 to 7), 78F0537DGB-UEU-A
PD78F053xGB(A)-GAH-AX (x = 1 to 7), 78F053xGB(A2)-GAH-AX (x = 1 to 7)
PD78F053xGC-UBS-A (x = 1 to 7), 78F0537DGC-UBS-A
PD78F053xGK-UET-A (x = 1 to 7), 78F0537DGK-UET-A
PD78F053xGA-9EV-A (x = 1 to 7), 78F0537DGA-9EV-A
PD78F054xGC-UBT-A (x = 4 to 7), 78F0547DGC-UBT-A
PD78F054xGK-8EU-A (x = 4 to 7), 78F0547DGK-8EU-A
PD78F054xGK(A)-GAK-AX (x = 4 to 7), 78F054xGK(A2)-GAK-AX (x = 4 to 7)
The
Do not use the on-chip debug function in products designated for mass production, because the
guaranteed number of rewritable times of the flash memory may be exceeded when this function is
used, and product reliability therefore cannot be guaranteed. Renesas Electronics is not liable for
problems occurring when the on-chip debug function is used.
μ
PD78F05xxD has an on-chip debug function, which is provided for development and evaluation.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 32 ELECTRICAL SPECIFICATIONS (A2) GRADE PRODUCTS
Soldering Conditions
Note
(after that, prebake at 125°C for
μ
PD78F05xx and 78F05xxD) (2/3)
IR60-207-3
Condition Symbol
Recommended
913

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