FAN2558MP15X Fairchild Semiconductor, FAN2558MP15X Datasheet - Page 8

• Manufacturer Part Number: FAN2558MP15X
• Description: IC REG LDO 180MA 1.5V 2X2 6MLP
• Manufacturer: Fairchild Semiconductor

Specifications of FAN2558MP15X

• Regulator Topology: Positive Fixed
• Voltage - Output: 1.5V
• Voltage - Input: 2.7 ~ 5.5 V
• Number Of Regulators: 1
• Current - Output: 180mA (Max)
• Current - Limit (min): 260mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-MLP
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 5.5 V
• Output Voltage: 1.5 V
• Output Type: Fixed
• Dropout Voltage (max): 400 mV
• Output Current: 180 mA
• Line Regulation: 0.3 % / V
• Load Regulation: 2.5 %
• Voltage Regulation Accuracy: 1 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Dropout (typical): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

General PCB Layout Considerations
For optimum device performance, careful circuit layout and
grounding techniques must be used. Establishing a small
local ground, to which the GND pin, and the output and
bypass capacitors are connected, is recommended. The input
capacitor should be grounded to the main ground plane. The
quiet local ground is then routed back to the main ground
plane using feed through via. In general, the high-frequency
compensation components (input, bypass, and output capaci-
tors) should be located as close to the device as possible.
Close proximity of the output capacitor is especially impor-
tant to achieve optimum performance, especially during high
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FAN2558/FAN2559
load conditions. A large copper area in the local ground
serves as heat sink (as discussed above) when high power
dissipation significantly increases device temperature. Com-
ponent-side copper provides significantly better thermal per-
formance. Added feed through connecting the device side
ground plane to the back plane further reduces thermal resis-
tance.
PRODUCT SPECIFICATIONS
REV. 1.0.4 3/15/04