A3P125-FGG144 Actel, A3P125-FGG144 Datasheet - Page 19

• Manufacturer Part Number: A3P125-FGG144
• Description: FPGA - Field Programmable Gate Array 125K System Gates
• Manufacturer: Actel

Specifications of A3P125-FGG144

• Processor Series: A3P125
• Core: IP Core
• Maximum Operating Frequency: 350 MHz
• Number Of Programmable I/os: 133
• Data Ram Size: 36864
• Delay Time: 11.1 ns
• Supply Voltage (max): 1.575 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Development Tools By Supplier: A3PE-Proto-Kit, A3PE-Brd1500-Skt, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, FlashPro 4, FlashPro 3, FlashPro Lite
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.425 V
• Number Of Gates: 125 K
• Package / Case: FPBGA-144
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 2-5 • Package Thermal Resistivities
Package Type
Quad Flat No Lead
Very Thin Quad Flat Pack (VQFP)
Thin Quad Flat Pack (TQFP)
Plastic Quad Flat Pack (PQFP)
PQFP with embedded heatspreader
Fine Pitch Ball Grid Array (FBGA)
*
Maximum Power Allowed
This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal information
will be available in future revisions of the datasheet.
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction to be higher than the ambient temperature.
EQ 1
where:
T
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
θ
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ
θ
temperature is 100°C.
allowed for a 484-pin FBGA package at commercial temperature and in still air.
A
ja
ja
. The thermal characteristics for θ
= Ambient Temperature
= Junction-to-ambient of the package. θ
T
J
can be used to calculate junction temperature.
= Junction Temperature = ΔT + T
=
Max. junction temp. (°C) Max. ambient temp. (°C)
-------------------------------------------------------------------------------------------------------------------------------------- -
EQ 2
All devices
All devices
All devices
All devices
See note*
See note*
See note*
A3P1000
A3P1000
A3P1000
A3P030
A3P060
A3P125
A3P250
shows a sample calculation of the absolute maximum power dissipation
Device
ja
θ
are shown for two air flow rates. The absolute maximum junction
A
ja
Pin Count
(°C/W)
–
ja
132
132
132
132
100
144
208
208
144
256
484
144
256
484
R e v i s i o n 9
numbers are located in
jc
and the junction-to-ambient air thermal resistivity is
10.0
11.0
0.4
0.3
0.2
0.1
8.0
3.8
3.8
3.8
3.2
6.3
6.6
8.0
θ
jc
Still Air 200 ft./min.
21.4
21.2
21.1
21.0
35.3
33.5
26.1
16.2
26.9
26.6
20.5
31.6
28.1
23.3
Table
=
100°C 70°C
------------------------------------
ja
16.8
16.6
16.5
16.4
29.4
28.0
22.5
13.3
22.9
22.8
17.0
26.2
24.4
19.0
20.5°C/W
2-5.
* P
θ
ProASIC3 Flash Family FPGAs
ja
–
500 ft./min.
=
15.3
15.0
14.9
14.8
27.1
25.7
20.8
21.5
21.5
15.9
24.2
22.7
16.7
11.9
1.463 W
·
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
EQ 1
EQ 2
2 -5