LIS3LV02DL STMicroelectronics, LIS3LV02DL Datasheet - Page 21

• Manufacturer Part Number: LIS3LV02DL
• Description: Board Mount Accelerometers MEMS INERTIAL SENSOR
• Manufacturer: STMicroelectronics

Specifications of LIS3LV02DL

• Sensing Axis: X, Y, Z
• Acceleration: 2 g, 6 g
• Digital Output - Number Of Bits: 12 bit, 16 bit
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.16 V
• Supply Current: 0.65 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Digital Output - Bus Interface: I2C, SPI
• Sensitivity: 1024 LSB/g
• Package / Case: LGA-16
• Output Type: Digital
• Acceleration Range: ±2g, ±6g
• No. Of Axes: 3
• Interface Type: I2C, SPI
• Sensitivity Per Axis: 1024LSB / G
• Sensor Case Style: LGA
• No. Of Pins: 16
• Supply Voltage Range: 2.16V To 3.6V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

LIS3LV02DL
4
4.1
Application hints
Figure 5.
The device core is supplied through Vdd line while the I/O pads are supplied through
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF Al) should be
placed as near as possible to the pin 13 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to
without blocking the communication busses. In this condition the measurement chain is
powered off.
The functionality of the device and the measured acceleration data is selectable and
accessible through the I
SDO must be left floating. Refer to dedicated application note for further information on
device usage.
The functions, the trasholds and the timing of the interrupt pin (INT) can be completely
programmed by the user through the I
Soldering Information
The LGA-16 package is compliant with the ECOPACK
It is qualified for soldering heat resistance according to JEDEC J-STD-020C.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
Vdd_IO
LIS3LV02DL electrical connection
GND
Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO
7
2
8
C/SPI interface.When using the I
6
Figure
9
(TOP VIEW)
LIS3LV02DL
7). It is possible to remove Vdd maintaining Vdd_IO
2
C/SPI interface.
14
1
16
15
®
, RoHS and “Green” standard.
2
C, CS must be tied high while
100nF
DIRECTION OF THE
DETECTABLE
ACCELERATIONS
10uF
Z
Vdd
Application hints
1
X
Y
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