LIS3LV02DL STMicroelectronics, LIS3LV02DL Datasheet - Page 46

Board Mount Accelerometers MEMS INERTIAL SENSOR

LIS3LV02DL

Manufacturer Part Number
LIS3LV02DL
Description
Board Mount Accelerometers MEMS INERTIAL SENSOR
Manufacturer
STMicroelectronics
Datasheet

Specifications of LIS3LV02DL

Sensing Axis
X, Y, Z
Acceleration
2 g, 6 g
Digital Output - Number Of Bits
12 bit, 16 bit
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.16 V
Supply Current
0.65 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Digital Output - Bus Interface
I2C, SPI
Sensitivity
1024 LSB/g
Package / Case
LGA-16
Output Type
Digital
Acceleration Range
±2g, ±6g
No. Of Axes
3
Interface Type
I2C, SPI
Sensitivity Per Axis
1024LSB / G
Sensor Case Style
LGA
No. Of Pins
16
Supply Voltage Range
2.16V To 3.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LIS3LV02DL
Manufacturer:
ST
0
Part Number:
LIS3LV02DL
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
LIS3LV02DL
Quantity:
2 940
Part Number:
LIS3LV02DL-TR
Manufacturer:
ST
0
Part Number:
LIS3LV02DL@@@@
Manufacturer:
ST
0
Part Number:
LIS3LV02DLTR
Manufacturer:
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0
Package information
9
46/48
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK
ECOPACK
Figure 28. LGA-16 mechanical data and package dimensions
®
DIM.
A1
A2
A3
D1
E1
N1
P1
P2
L1
T1
T2
Metal Pad
Detail A
N
R
e
d
h
k
s
i
specifications are available at: www.st.com.
D1
0.180
4.250
7.350
0.965
1.200
MIN.
0.64
0.75
0.45
(4 x)
i
B
k
i
A
C
C
A
A
B
0.220
4.400
7.500
5.000
0.975
0.150
0.050
0.100
0.100
TYP.
0.92
0.65
mm
B
1.0
0.3
2.5
1.2
0.8
0.5
E
P2
MAX.
0.260 0.0071 0.0087 0.0102
4.550 0.1673 0.1732 0.1791
7.650 0.2894 0.2953 0.3012
0.985 0.0380 0.0384 0.0388
1.600 0.0472
0.66
0.85
0.55
0.7
1
E1
Solder mask
opening
0.0252 0.0256 0.0260
0.0295 0.0315 0.0335
0.0177 0.0197 0.0217
MIN.
h
C
k
A
0.0394
0.0118
0.1969
0.0984
0.0472
0.0059
0.0020
0.0039
0.0039
D
TYP.
B
inch
D
k
0.0394
0.0276
0.0630
P1
E
seating plane
MAX.
h
C
A
B
A3
R
A2
A1
i
i
C
Land Grid Array Package
LGA16 (4.4x7.5x1mm)
MECHANICAL DATA
Detail A
N1
e
OUTLINE AND
d
®
16
15
is an ST trademark.
14
1
E
13
2
N
12
3
L1
11
4
e
10
5
6
9
7863679 B
T2
7
8
s
D
LIS3LV02DL
T1
®

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