PIC24FJ256GB106-I/MR Microchip Technology, PIC24FJ256GB106-I/MR Datasheet - Page 45

IC, 16BIT MCU, PIC24F, 32MHZ, QFN-64

PIC24FJ256GB106-I/MR

Manufacturer Part Number
PIC24FJ256GB106-I/MR
Description
IC, 16BIT MCU, PIC24F, 32MHZ, QFN-64
Manufacturer
Microchip Technology
Series
PIC® 24Fr

Specifications of PIC24FJ256GB106-I/MR

Controller Family/series
PIC24
No. Of I/o's
51
Ram Memory Size
16KB
Cpu Speed
32MHz
No. Of Timers
5
Core Size
16 Bit
Program Memory Size
256KB
Peripherals
ADC, Comparator, PWM, RTC, Timer
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, SPI, UART/USART, USB OTG
Number Of I /o
51
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN, Exposed Pad
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
52
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24FJ256GB106-I/MR
Manufacturer:
TI
Quantity:
1 292
5.4.2
After
programmed to executive memory using ICSP, it must
be verified. Verification is performed by reading out the
contents of executive memory and comparing it with
the image of the programming executive stored in the
programmer.
TABLE 5-6:
© 2007 Microchip Technology Inc.
Step 1: Exit the Reset vector.
Step 2: Initialize TBLPAG and the Read Pointer (W6) for TBLRD instruction.
Step 3: Initialize the Write Pointer (W7) to point to the VISI register.
Step 4: Read and clock out the contents of the next two locations of executive memory through the VISI register
Step 5: Reset the device internal PC.
Step 6: Repeat Steps 4-5 until all 1024 instruction words of executive memory are read.
Command
(Binary)
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0001
0000
0000
0000
0000
0000
0000
0000
0001
0000
0000
0000
0000
0001
0000
0000
0000
the
using the REGOUT command.
PROGRAMMING VERIFICATION
programming
READING EXECUTIVE MEMORY
000000
040200
000000
200800
880190
EB0300
207847
000000
BA0B96
000000
000000
<VISI>
000000
BADBB6
000000
000000
BAD3D6
000000
000000
<VISI>
000000
BA0BB6
000000
000000
<VISI>
000000
040200
000000
(Hex)
Data
executive
NOP
GOTO
NOP
MOV
MOV
CLR
MOV
NOP
TBLRDL
NOP
NOP
Clock out contents of VISI register
NOP
TBLRDH.B
NOP
NOP
TBLRDH.B
NOP
NOP
Clock out contents of VISI register
NOP
TBLRDL
NOP
NOP
Clock out contents of VISI register
NOP
GOTO
NOP
has
0x200
#0x80, W0
W0, TBLPAG
W6
#VISI, W7
[W6], [W7]
[W6++], [W7++]
[++W6], [W7--]
[W6++], [W7]
0x200
been
PIC24FJXXXGA1/GB1
Reading the contents of executive memory can be
performed using the same technique described in
Section 3.8 “Reading Code Memory”. A procedure
for reading executive memory is shown in Table 5-6.
Note that in Step 2, the TBLPAG register is set to 80h,
such that executive memory may be read. The last
eight words of executive memory should be verified
with stored values of the Diagnostic and Calibration
Words to ensure accuracy.
Description
DS39907A-page 45

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