GRM155R60J225ME15D Murata, GRM155R60J225ME15D Datasheet - Page 119

• Manufacturer Part Number: GRM155R60J225ME15D
• Manufacturer: Murata

Specifications of GRM155R60J225ME15D

• Tolerance (+ Or -): 20%
• Voltage: 6.3VDC
• Temp Coeff (dielectric): X5R
• Operating Temp Range: -55C to 85C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 1mm
• Product Depth (mm): 0.5mm
• Product Height (mm): 0.5mm
• Product Diameter (mm): Not Requiredmm
• Capacitance: 2.2uF
• Package / Case: 0402
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
No.
11
12
13
14
15
ERB Series Specifications and Test Method (1)
Continued from the preceding page.
Vibration
Resistance
Resistance
to Soldering Heat
Deflection
Solderability of
Termination
Temperature
Cycle
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
Q
Appearance
Capacitance
Change
No defects or abnormalities
Within the specified tolerance
Satisfies the initial value.
220pFFCV1,220pF : QU10,000
220pFFCV1,470pF : QU15,000
470pFFCV1,000pF : QU13,000
C: Nominal Capacitance (pF)
No marking defects
Within T5% or T0.5pF
(Whichever is larger)
95% of the terminations are to be soldered evenly and
continuously.
The measured and observed characteristics should satisfy the
specifications in the following table.
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
Capacitance
Change
Q
Dielectric Strength
Appearance
Capacitance
Change
Q
I.R.
Dielectric Strength
R230
Capacitance meter
45
Item
Item
20
Fig.3a
50
45
Pressurize
Pressurizing
speed : 1.0mm/sec.
Specifications
Flexure : V1
No marked defect
Within T2.5% or T0.25pF
(Whichever is larger)
220pFFCV1,220pF : QU10,000
220pFFCV1,470pF : QU15,000
470pFFCV1,000pF : QU13,000
No failure
No marked defect
Within T5% or T0.5pF
(Whichever is larger)
10pFVCU30pF : QU350
10pFVCF30pF : QU275W
10pFVCF10pF : QU200W10C
1,000MΩ min.
No failure
C: Nominal Capacitance (pF)
C: Nominal Capacitance (pF)
Specifications
Specifications
ERB Series Specifications and Test Methods
Fig. 2a
100
b
c
a
5
2
t : 1.6mm
C
ø4.5
Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (10).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz.
The frequency range, from 10 to 55Hz and return to 10Hz,
should be traversed in approximately 1 minute. This motion
should be applied for a period of 2 hours in each of 3 mutually
perpendicular directions (total of 6 hours).
Solder the capacitor on the test jig (glass epoxy board) shown
in Fig. 2a using an eutectic solder. Then apply a force in the
direction shown in Fig. 3a. The soldering should be done by
the reflow method and should be conducted with care so that
the soldering is uniform and free of defects such as heat shock.
Immerse the capacitor in a solution of isopropyl alcohol and
rosin (25% rosin in weight proportion).
Preheat at 80 to 120D for 10 to 30 seconds.
After preheating, immerse in an eutectic solder
or Sn-3.0Ag-0.5Cu solder solution for 5±0.5 seconds
at 245±5D.
Preheat according to the conditions listed in the table below.
Immerse the capacitor in an eutectic solder or Sn-3.0Ag-0.5Cu
solder solution at 270±5D for 10±0.5 seconds. Let sit at room
temperature for 24±2 hours.
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10). Perform the five cycles
according to the four heat treatments listed in the following table.
Let sit for 24T2 hours at room temperature, then measure.
Temp. (D)
Time (min.)
2.0Z1.25mm max.
3.2Z2.5mm
Step
Chip Size
ERB18
ERB21
ERB32
Type
Temp. W0/Y3
Operating
30T3
Min.
1
Each 1 minute at 100 to 120D and then 170 to 200D
Test Method
1.0
1.2
2.2
a
1minute at 120 to 150D
5 max.
Temp.
Room
Continued on the following page.
Preheat Condition
2
Temp. W3/Y0
3.0
4.0
5.0
Operating
b
30T3
Max.
3
(in mm)
1.65
1.2
2.9
5 max.
Temp.
Room
c
4
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C02E.pdf
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