GRM155R60J225ME15D Murata, GRM155R60J225ME15D Datasheet - Page 54

• Manufacturer Part Number: GRM155R60J225ME15D
• Manufacturer: Murata

Specifications of GRM155R60J225ME15D

• Tolerance (+ Or -): 20%
• Voltage: 6.3VDC
• Temp Coeff (dielectric): X5R
• Operating Temp Range: -55C to 85C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 1mm
• Product Depth (mm): 0.5mm
• Product Height (mm): 0.5mm
• Product Diameter (mm): Not Requiredmm
• Capacitance: 2.2uF
• Package / Case: 0402
• Lead Free Status / RoHS Status: Compliant

1
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
52
No.
10
GRM Series Specifications and Test Methods (1) (Note1) Typical Inspection
9
Continued from the preceding page.
Capacitance
Temperature
Characteristics
Adhesive Strength
of Termination
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GRM Series Specifications and Test Methods (1) (Note1) Typical Inspection
Item
No bias
50% of
the Rated
Voltage
Capacitance
Drift
Within the specified tolerance
(Table A-1)
Within 0.2% or 0.05pF
(Whichever is larger.)
*Do not apply to 1X/25V
No removal of the terminations or other defect should occur.
Compensating Type
Temperature
In case Non "*" is added in PNs table, please refer to GRM Series Specifications and Test Methods (1).
Specifications
In case "*" is added in PNs table, please refer to GRM Series Specifications and Test Methods (2).
Fig. 1a
B1, B3: Within 10%
R1, R7: Within 15%
R6: Within 15%
E4: Within +22/–56%
F1: Within +30/–80%
F5: Within +22/–82%
C8: Within 22%
B1: Within +10/–30%
R1: Within +15/–40%
F1: Within +30/–95%
*Initial measurement for high
dielectric constant type
Perform a heat treatment at
150+0/–10 C for one hour
and then set for 24 2 hours
at room temperature.
Perform the initial
measurement.
Please refer to individual specifications (our product specifications or the approval sheet).
c
High Dielectric Type
Baked electrode or
copper foil
Solder resist
(–55 to +125 C)
(–55 to +105 C)
(–25 to +85 C)
(–55 to +85 C)
(+10 to +85 C)
(–25 to +85 C)
(–30 to +85 C)
(Note1) This Specifications and Test Methods indicates typical inspection.
The capacitance change should be measured after 5 min. at
each specified temp. stage.
(1)Temperature Compensating Type
The temperature coefficient is determined using the
capacitance measured in step 3 as a reference.
When cycling the temperature sequentially from step 1 through
5 (5C: +25 to +125 C/ C: +20 to +125 C: other temp. coeffs.:
+25 to +85 C/+20 to +85 C) the capacitance should be within
the specified tolerance for the temperature coefficient and
capacitance change as Table A-1.
The capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in the
step 1, 3 and 5 by the cap. value in step 3.
(2) High Dielectric Constant Type
The ranges of capacitance change compared with the
Reference Temperature value over the temperature ranges
shown in the table should be within the specified ranges.*
In case of applying voltage, the capacitance change should be
measured after 1 more min. with applying voltage in
equilibration of each temp. stage.
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 1a using an eutectic solder. Then apply 10N* force in
parallel with the test jig for 10 1 sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*1N (GRM02), 2N (GRM03), 5N (GRM15, GRM18)
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
GRM43
GRM55
Step
1
2
3
4
5
6
7
8
Step
Type
1
2
3
4
5
–30 3 (for F5)/10 3 (for E4)
Reference Temperature 2
–55 3 (for C8, R1, R7, R6)
Reference Temperature 2
Reference Temperature 2
Reference Temperature 2
F1, F5, E4)/105 3 (for C8)
–25 3 (for B1, B3, F1)
85 3 (for B1, B3, R6
125 3 (for R1, R7)/
–25 3 (for B1, F1)
Temperature ( C)
85 3 (for B1, F1)
–55 3 (for R1)/
125 3 (for R1)/
125 3 (for C/R7), 105 3 (for C8)
–55 3 (for C to 7U/R6/R7/C8)
0.2
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
Test Method
a
–30 3 (for F5), 10 3 (for E4)
Reference Temperature 2
Reference Temperature 2
Reference Temperature 2
–25 3 (for other TC)
85 3 (for other TC)
Continued on the following page.
Temperature ( C)
0.56
0.9
1.5
3.0
4.0
5.0
5.0
7.0
8.0
b
Applying Voltage (V)
50% of the rated
No bias
voltage
0.23
1.65
0.3
0.5
1.2
2.0
2.9
3.7
5.6
(in mm)
c
C02E.pdf
09.9.18