GRM155R60J225ME15D Murata, GRM155R60J225ME15D Datasheet - Page 161

• Manufacturer Part Number: GRM155R60J225ME15D
• Manufacturer: Murata

Specifications of GRM155R60J225ME15D

• Tolerance (+ Or -): 20%
• Voltage: 6.3VDC
• Temp Coeff (dielectric): X5R
• Operating Temp Range: -55C to 85C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 1mm
• Product Depth (mm): 0.5mm
• Product Height (mm): 0.5mm
• Product Diameter (mm): Not Requiredmm
• Capacitance: 2.2uF
• Package / Case: 0402
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Solderability
(1) Test Method
Table 1
2. Board Bending Strength for Solder Fillet Height
(1) Test Method
(2) Test Samples
(3) Acceptance Criteria
Table 2
1
Characteristics
Subject the chip capacitor to the following conditions.
Then apply flux (an ethanol solution of 25% rosin) to the
chip and dip it in 230D eutectic solder for 2 seconds.
Conditions:
Expose prepared at room temperature (for 6 months and
12 months, respectively)
Prepared at high temperature (for 100 hours at 85D)
Prepared left at high humidity (for 100 hours under
90%RH to 95%RH at 40D)
Solder the chip capacitor to the test PCB with the amount
of solder paste necessary to achieve the fillet heights.
Then bend the PCB using the method illustrated and
measure capacitance.
GRM21: 5C/R7/F5 Characteristics T=0.6mm
Products should be determined to be defective if the
change in capacitance has exceeded the values specified
in Table 2.
GRM21 for flow/reflow soldering
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
5C
R7
F5
Sample
Within T5% or T0.5pF, whichever is greater
Within T12.5%
Within T20%
Material : Glass Epoxy
45
: Copper Foil (0.35mm thick)
: Solder Resist
1.2
Change in Capacitance
100
45
Capacitor
4.0
Initial State
95 to 100%
Supporting
Base
95 to 100%
Prepared at Room Temperature
6 months
1.6
R230
Capacitance Meter
12 months
Solder Amount
(2) Test Samples
(3) Acceptance Criteria
(4) Results
95%
20 50
GRM21 : Products for flow/reflow soldering.
With a 60-power optical microscope, measure the surface
area of the outer electrode that is covered with solder.
Refer to Table 1.
Pressurize
Pressurizing
Speed : 1.0mm/sec.
Flexure
100 Hours at 85D
Prepared at High
Temperature for
90 to 95%
Note : The material of pressure application jig and
support is the quenched metal.
(hardness HB 183-255 or superhardness
HRA90 or more)
Continued on the following page.
Reference Data
Prepared at High Humidity
for 100 Hours at 90 to
Larger Fillet.
Fillet up to Chip
Thickness
95% RH and 40D
95%
(in mm)
159
C02E.pdf
09.9.18
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