GRM155R60J225ME15D Murata, GRM155R60J225ME15D Datasheet - Page 187

• Manufacturer Part Number: GRM155R60J225ME15D
• Manufacturer: Murata

Specifications of GRM155R60J225ME15D

• Tolerance (+ Or -): 20%
• Voltage: 6.3VDC
• Temp Coeff (dielectric): X5R
• Operating Temp Range: -55C to 85C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 1mm
• Product Depth (mm): 0.5mm
• Product Height (mm): 0.5mm
• Product Diameter (mm): Not Requiredmm
• Capacitance: 2.2uF
• Package / Case: 0402
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
No.
11
12
13
14
15
Continued from the preceding page.
Resistance
to Soldering
Heat
Deflection
Solderability of
Termination
Temperature
Cycle
Humidity
(Steady
State)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
No cracking or marking defects should occur.
75% of the terminations are to be soldered evenly and continuously.
No marking defects
Within T10%
0.025 max.
CU0.01 F: More than 100MΩ • F
CF0.01 F: More than 10,000MΩ
In accordance with item No.4
No marking defects
Within T7.5%
0.025 max.
CU0.01 F: More than 100MΩ • F
CF0.01 F: More than 10,000MΩ
In accordance with item No.4
No marking defects
Within T15%
0.05 max.
CU0.01 F: More than 10MΩ • F
CF0.01 F: More than 1,000MΩ
In accordance with item No.4
3.2Z1.6
LZW
(mm)
2.2
a
d
Specifications
100
b
a
c
Fig. 2
Dimension (mm)
5.0
b
4.5
t : 1.6
2.0
c
1.0
d
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
Preheat the capacitor at 120 to 150D
Immerse the capacitor in solder solution at 260T5D for 10T1
sec. Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
#Pretreatment
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition*, then measure.
#Pretreatment
Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
for 500
Remove and let sit for 24T2 hrs. at room condition*, then
measure.
#Pretreatment
Specifications and Test Methods
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition*.
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition*.
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition*.
Step
W24
Y00
1
2
3
4
hrs.
Max. Operating Temp.T2
Min. Operating Temp.T3
235T5°C H60A or H63A Eutectic Solder
Glass Epoxy Board
Temperature (D)
R230
Capacitance meter
Room Temp.
Room Temp.
45
Fig. 3
Fig. 4
Test Method
20 50
45
Continued on the following page.
Pressurize
W00
Y10
W00
Y10
W00
Y10
Pressurizing
speed: 1.0mm/s
*
Flexure=1
D for 60T5 min. and then
D for 60T5 min. and then
D for 60T5 min. and then
for 1 min.
Solder resist
Cu
(in mm)
Time (min.)
30T3
2 to 3
30T3
2 to 3
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C02E.pdf
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