DIODE SWITCH 75V 215MA SOD-123

BAS116H,115

Manufacturer Part NumberBAS116H,115
DescriptionDIODE SWITCH 75V 215MA SOD-123
ManufacturerNXP Semiconductors
BAS116H,115 datasheet
 


Specifications of BAS116H,115

Package / CaseSOD-123 Flat LeadsVoltage - Forward (vf) (max) @ If1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)75VCurrent - Average Rectified (io)215mA (DC)
Current - Reverse Leakage @ Vr5nA @ 75VDiode TypeStandard
SpeedStandard Recovery >500ns, > 200mA (Io)Reverse Recovery Time (trr)3µs
Capacitance @ Vr, F2pF @ 0V, 1MHzMounting TypeSurface Mount
ProductSwitching DiodesPeak Reverse Voltage75 V
Forward Continuous Current0.215 AMax Surge Current4 A
ConfigurationSingleRecovery Time3 ns
Forward Voltage Drop1.25 VMaximum Reverse Leakage Current5 uA
Operating Temperature Range+ 150 CMaximum Operating Temperature+ 150 C
Minimum Operating Temperature- 65 CMounting StyleSMD/SMT
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names934059308115
BAS116H T/R
BAS116H T/R
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BAS116H
75 V, low leakage diode in small SOD123F package
Rev. 02 — 14 December 2009
1. Product profile
1.1 General description
Low leakage switching diode, encapsulated in a SOD123F small SMD plastic package.
1.2 Features
Small and flat lead SMD plastic package
Low leakage current
1.3 Applications
General-purpose switching
1.4 Quick reference data
Table 1.
Symbol
I
F
V
R
I
R
Quick reference data
Parameter
Conditions
forward current
reverse voltage
reverse current
V
= 75 V
R
Product data sheet
Min
Typ
Max
Unit
-
-
215
mA
-
-
75
V
-
0.003
5.0
nA

BAS116H,115 Summary of contents

  • Page 1

    BAS116H 75 V, low leakage diode in small SOD123F package Rev. 02 — 14 December 2009 1. Product profile 1.1 General description Low leakage switching diode, encapsulated in a SOD123F small SMD plastic package. 1.2 Features Small and flat lead ...

  • Page 2

    ... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number BAS116H 4. Marking Table 4. Type number BAS116H 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM ...

  • Page 3

    ... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table 7. ° amb Symbol Per diode [1] Pulse test: t [2] When switched from I BAS116H_2 Product data sheet ...

  • Page 4

    ... NXP Semiconductors 300 I F (mA) 200 (1) 100 0 0 0.4 0.8 = 150 °C; typical values (1) T amb = 25 °C; typical values (2) T amb = 25 °C; maximum values (3) T amb Fig 1. Forward current as a function of forward voltage (nA) 10 (1) 1 −1 10 (2) −2 10 − 100 (1) Maximum values (2) Typical values Fig 3 ...

  • Page 5

    ... NXP Semiconductors 8. Test information D.U.T. I Ω × ( Fig 5. Reverse recovery time test circuit and waveforms BAS116H_2 Product data sheet 75 V, low leakage diode in small SOD123F package SAMPLING OSCILLOSCOPE Ω mga881 input signal Rev. 02 — 14 December 2009 BAS116H (1) output signal © NXP B.V. 2010. All rights reserved. ...

  • Page 6

    ... NXP Semiconductors 9. Package outline Fig 6. Package outline SOD123F 10. Packing information Table 8. Packing methods The -xxx numbers are the last three digits of the 12NC ordering code. Type number Package Description BAS116H SO123F 4 mm pitch tape and reel [1] For further information and the availability of packing methods, see 11 ...

  • Page 7

    ... Revision history Document ID Release date BAS116H_2 20091214 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. BAS116H_1 20050411 BAS116H_2 Product data sheet 75 V, low leakage diode in small SOD123F package ...

  • Page 8

    ... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

  • Page 9

    ... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information . . . . . . . . . . . . . . . . . . . . . 6 11 Soldering ...