STM32F100RET6B STMicroelectronics, STM32F100RET6B Datasheet - Page 38

• Manufacturer Part Number: STM32F100RET6B
• Description: 16/32-BITS MICROS
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F100RET6B

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 24MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Electrical characteristics
5.3.2
38/97
Table 9.
1. When the ADC is used, refer to
2. If T
3. In low power dissipation state, T
Operating conditions at power-up / power-down
Subject to general operating conditions for T
Table 10.
Symbol
Thermal characteristics on page
Section 6.2: Thermal characteristics on page
Symbol
P
T
T
A
A
t
D
J
VDD
is lower, higher P
General operating conditions (continued)
Operating conditions at power-up / power-down
Power dissipation at T
85 °C for suffix 6 or T
105 °C for suffix 7
Ambient temperature for 6
suffix version
Ambient temperature for 7
suffix version
Junction temperature range
V
V
DD
DD
D
rise time rate
fall time rate
Parameter
values are allowed as long as T
A
Table 51: ADC
(2)
92).
can be extended to this range as long as T
Parameter
Doc ID 15081 Rev 5
A
A
=
=
92).
characteristics.
LQFP144
LQFP100
LQFP64
Maximum power dissipation
Low power dissipation
Maximum power dissipation
Low power dissipation
6 suffix version
7 suffix version
STM32F100xC, STM32F100xD, STM32F100xE
A
.
J
Conditions
does not exceed T
Min
20
0
(3)
(3)
J
J
does not exceed T
max (see
Min
–40
–40
–40
–40
–40
–40
Max
Section 6.2:
∞
∞
Max
TBD
TBD
TBD
105
105
125
105
125
85
J
max (see
µs/V
Unit
Unit
mW
°C
°C
°C