STM32F100RET6B STMicroelectronics, STM32F100RET6B Datasheet - Page 96

• Manufacturer Part Number: STM32F100RET6B
• Description: 16/32-BITS MICROS
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F100RET6B

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 24MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Revision history
8
96/97
Revision history
Table 62.
01-Sep-2010
31-Mar-2009
09-Oct-2008
18-Oct-2010
11-Apr-2011
Date
Document revision history
Revision
1
2
3
4
5
Initial release.
I/O information clarified on page 1.
Table 5: High-density STM32F100xx pin definitions modified.
Figure 5: Memory map on page 26 modified.
Note modified in Table 13: Maximum current consumption in Run
mode, code with data processing running from Flash and Table 15:
Maximum current consumption in Sleep mode, code running from
Flash or RAM.
Table 20: High-speed external user clock characteristics and Table
21: Low-speed user external clock characteristics modified. ACCHSI
max values modified in Table 24: HSI oscillator characteristics.
Note modified in Table 13: Maximum current consumption in Run
mode, code with data processing running from Flash and Table 15:
Maximum current consumption in Sleep mode, code running from
Flash or RAM.
Figure 10, Figure 11 and Figure 12 show typical curves (titles
changed).
Small text changes.
Major revision of whole document.
Added LQFP144 package and additional peripherals (SPI3, UART4,
UART, TIM5, 12, 14, 13, FSMC).
Updated Power consumption data in
Updated
Added
In
remap to default column. Updated description of PA3, PA5 and PF6
to PF10.
Updated footnotes below
and
Added VBAT values in
consumptions in Stop and Standby modes on page 43
Updated tw min in
characteristics on page 47
Updated startup time in
(fLSE = 32.768 kHz) on page 51
Added HSI clock accuracy values in
characteristics on page 52
Updated FSMC
Updated
Added
page 68
Corrected TTL and CMOS designations in
characteristics on page 72
Doc ID 15081 Rev 5
Table 4 on page 24
Table 7: Current characteristics on page 37
Section 2.2.6: LCD parallel interface on page 13
Section 5.3.13: I/O current injection characteristics on
Section 5.3.11: EMC characteristics on page 66
Table 43: I/O static characteristics on page 69
STM32F100xC, STM32F100xD, STM32F100xE
Synchronous waveforms and timings on page 60
Table 20: High-speed external user clock
moved TIM15_BKIN and TIM17_BKIN from
Table 16: Typical and maximum current
Table 23: LSE oscillator characteristics
Table 6: Voltage characteristics on page 36
Changes
Table 24: HSI oscillator
Table 13
Table 44: Output voltage
to
Table 16