STM32F100RET6B STMicroelectronics, STM32F100RET6B Datasheet - Page 45

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STM32F100RET6B

Manufacturer Part Number
STM32F100RET6B
Description
16/32-BITS MICROS
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F100RET6B

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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STM32F100xC, STM32F100xD, STM32F100xE
Table 18.
1. Typical values are measures at T
2. Add an additional power consumption of 0.8 mA for the ADC and of 0.5 mA for the DAC analog part. In
3. An 8 MHz crystal is used as the external clock source. The AHB prescaler is used to reduce the frequency
I
Symbol Parameter
DD
applications, this consumption occurs only while the ADC is on (ADON bit is set in the ADC_CR2 register).
when f
HCLK
Supply
current in
Sleep
mode
Typical current consumption in Sleep mode, code running from Flash or
RAM
> 8 MHz, the PLL is used when f
Running on high-speed
external clock with an
8 MHz crystal
Running on high-speed
internal RC (HSI)
Conditions
A
Doc ID 15081 Rev 5
= 25 °C, V
(3)
HCLK
DD
= 3.3 V.
> 8 MHz.
24 MHz
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
125 kHz
24 MHz
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
125 kHz
f
HCLK
All peripherals
enabled
2.25
1.35
1.65
1.65
0.65
0.53
8.7
6.1
3.3
1.2
1.1
5.5
2.7
1.1
0.8
8
Typical values
(2)
Electrical characteristics
All peripherals
disabled
2.75
1.15
1.07
1.05
2.15
0.75
0.55
0.49
0.47
(1)
2.1
1.3
1.2
1.1
1.5
0.6
0.5
mA
Unit
45/97

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