M368L6423FTNCB3 Samsung Semiconductor, M368L6423FTNCB3 Datasheet - Page 24

• Manufacturer Part Number: M368L6423FTNCB3
• Manufacturer: Samsung Semiconductor

Specifications of M368L6423FTNCB3

• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 184UDIMM
• Device Core Size: 64b
• Organization: 64Mx64
• Total Density: 512MByte
• Chip Density: 256Mb
• Access Time (max): 700ps
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 1.72A
• Number Of Elements: 16
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 184
• Mounting: Socket
• Lead Free Status / RoHS Status: Not Compliant

128MB, 256MB, 512MB Unbuffered DIMM
(31.75 ±0.15)
1.25 ± 0.006
Tolerances : ± 0.005(.13) unless otherwise specified.
The used device is 32Mx8 DDR SDRAM, TSOPII.
DDR SDRAM Part No : K4H560838F
17.4 64Mx64 (M368L6423FT(U))
2.175
Detail A
(6.350)
0.250
0.071
(1.80)
(64.77)
2.55
0.1496
(3.80)
(133.350 ± 0.13)
5.25 ± 0.005
(128.950)
5.077
A
Detail B
(49.53)
1.95
(1.270)
0.050
(1.000 ± 0.050)
B
0.0078 ± 0.006
0.039 ± 0.002
(0.20 ± 0.15)
0.118 Min
(3.00 Min)
0.10 M C A M B
Rev. 1.3 July 2005
0.1575 ± 0.004
Units : Inches (Millimeters)
R (2.00)
(4.00 ± 0.1)
0.0787
DDR SDRAM
2.500 +0.1/-0.0
0.118 Min
(3.00 Min)
0.10 M
0.050 ± 0.0039
(1.270 ± 0.10)
(3.67 Max)
0.145 Max
C B A