AMD-K6-IIIE+550ACR AMD (ADVANCED MICRO DEVICES), AMD-K6-IIIE+550ACR Datasheet - Page 24

• Manufacturer Part Number: AMD-K6-IIIE+550ACR
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AMD-K6-IIIE+550ACR

• Lead Free Status / RoHS Status: Not Compliant

AMD-K6™-IIIE+ Embedded Processor Data Sheet
2
AMD PowerNow!™ technology dynamically manages power and performance
3DNow!™ technology for better multimedia and audio performance
High-performance IEEE 754-compatible and 854-compatible floating-point unit
High-performance industry-standard MMX™ instructions
Industry-standard System Management Mode (SMM)
IEEE 1149.1 boundary scan
321-Pin Ceramic Pin Grid Array (CPGA) or 349-Ball Organic Ball Grid Array
(OBGA) package
Low-voltage 0.18-micron process technology
Operating frequencies
2x Accelerated Graphic Port (AGP) support
Takes advantage of existing system support, logic integration, and designs for
superior value
Provides an easy upgrade path for embedded applications and a bridge to
legacy applications
Monitors application requirements for performance or power utilization
Supports continuously varying operating frequency and voltage, delivering
performance on demand while dissipating the lowest amount of power possible
x86 instruction set extension accelerates 3D graphics and other single-
precision floating-point compute-intensive operations
Offers fast frame rates on high-resolution graphics applications, superior
modeling of real-world environments and physics, life-like images and
graphics, and big-screen sound and video
Additional 3DNow! technology DSP instructions enhance communications
applications
Separate multiplier and ALU for superscalar instruction execution
Dual-integer ALU for superscalar execution
Split-plane power with support for full 3.3 V I/O
Lower core voltages enable low-power operation
Standard-power and standard-temperature devices: 400, 450, 500, and 550 MHz
Low-power and extended-temperature devices: 400, 450, and 500 MHz
AMD-K6™-IIIE+ Embedded Processor
Preliminary Information
23543A/0—September 2000
Chapter 1