AMD-K6-IIIE+550ACR AMD (ADVANCED MICRO DEVICES), AMD-K6-IIIE+550ACR Datasheet - Page 338

• Manufacturer Part Number: AMD-K6-IIIE+550ACR
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AMD-K6-IIIE+550ACR

• Lead Free Status / RoHS Status: Not Compliant

AMD-K6™-IIIE+ Embedded Processor Data Sheet
316
Table 72. Package Thermal Specification for Low-Power
Table 73. Package Thermal Specification for Standard-Power
Figure 113 on page 317 shows the thermal model of a processor
w it h a p as sive t h e rm a l so lut i on. The c a se -t o -a m b ie n t
temperature (T
equation:
Where:
T
T
C
T
P
q
q
q
C
Stop Grant Mode
Stop Grant Mode
Stop Clock Mode
Stop Clock Mode
CA
IF
SA
CA
MAX
Case Temperature
Case Temperature
Junction-Case
Junction-Case
1.0
1.0°C/W
AMD-K6™-IIIE+ Devices
AMD-K6™-IIIE+ Devices
q
q
°
= P
= P
= Maximum Power Consumption
= Case-to-Ambient Thermal Resistance
= Interface Material Thermal Resistance
= Sink-to-Ambient Thermal Resistance
Preliminary Information
JC
JC
C/W
MAX
MAX
Thermal Design
• q
• ( q
CA
CA
) can be calculated from the following
IF
400 MHz
16.50 W
+ q
400 MHz
9.50 W
1.60 W
SA
)
Maximum Thermal Power
Maximum Thermal Power
450 MHz
17.50 W
450 MHz
0°C–70°C
12.00 W
0°C–85
4.50 W
4.00 W
2.50 W
500 MHz
18.50 W
23543A/0—September 2000
1.90 W
500 MHz
14.50 W
550 MHz
Chapter 17
19.50 W