MT47H512M8WTR-3:C Micron Technology Inc, MT47H512M8WTR-3:C Datasheet - Page 15

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MT47H512M8WTR-3:C

Manufacturer Part Number
MT47H512M8WTR-3:C
Description
IC DDR2 SDRAM 4GBIT 63FBGA
Manufacturer
Micron Technology Inc
Series
-r
Datasheet

Specifications of MT47H512M8WTR-3:C

Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
4G (512M x 8)
Speed
3ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
63-TFBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Package Dimensions
Figure 5: 63-Ball FBGA (12mm x 14mm) (THM)
PDF: 09005aef8227ee4d
mt47h1g_64m_32m_twindie.pdf - Rev. H 04/11 EN
Solder ball
material: SAC305.
Dimensions apply
to solder balls
post-reflow on
Ø0.33 NSMD
ball pads.
63X Ø0.45
8 CTR
Seating
plane
0.12 A
0.8 TYP
A
Note:
9 8 7
1. All dimensions are in millimeters.
12 ±0.15
0.8 TYP
6.4 CTR
3 2 1
A
B
C
D
E
F
G
H
J
K
L
1 ±0.1
15
Ball A1 ID
14 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
4Gb: x4, x8 TwinDie DDR2 SDRAM
0.25 MIN
1.35 MAX
Package Dimensions
Ball A1 ID
© 2006 Micron Technology, Inc. All rights reserved.

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