UPD78F0988AGC-8BS Renesas Electronics America, UPD78F0988AGC-8BS Datasheet - Page 401
UPD78F0988AGC-8BS
Manufacturer Part Number
UPD78F0988AGC-8BS
Description
Manufacturer
Renesas Electronics America
Datasheet
1.UPD78F0988AGC-8BS.pdf
(431 pages)
Specifications of UPD78F0988AGC-8BS
Lead Free Status / Rohs Status
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(1)
(2)
Infrared reflow
VPS
Wave soldering
Partial heating
Infrared reflow
VPS
Wave soldering
Partial heating
This product should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Caution Do not use different soldering methods together (except for partial heating).
Caution Do not use different soldering methods together (except for partial heating).
Soldering Method
Soldering Method
PD78F0988AGC-AB8: 64-pin plastic QFP (14
PD780982GC-xxx-8BS:
PD780983GC-xxx-8BS:
PD780984GC-xxx-8BS:
PD780986GC-xxx-8BS:
PD780988GC-xxx-8BS:
PD780982GC(A)-xxx-8BS: 64-pin plastic LQFP (14
PD780983GC(A)-xxx-8BS: 64-pin plastic LQFP (14
PD780984GC(A)-xxx-8BS: 64-pin plastic LQFP (14
PD780986GC(A)-xxx-8BS: 64-pin plastic LQFP (14
PD780988GC(A)-xxx-8BS: 64-pin plastic LQFP (14
PD78F0988AGC(A)-AB8:
CHAPTER 23 RECOMMENDED SOLDERING CONDITIONS
Table 23-1. Surface Mounting Type Soldering Conditions (1/2)
Package peak temperature: 235 C, Time: 30 seconds max.
(at 210 C or higher), Count: Three times or less
Package peak temperature: 215 C, Time: 40 seconds max.
(at 200 C or higher), Count: Three times or less
Solder bath temperature: 260 C max., Time: 10 seconds max.,
Count: Once, Preheating temperature: 120 C max. (package surface
temperature)
Pin temperature: 350 C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 235 C, Time: 30 seconds max.
(at 210 C or higher), Count: Two times or less
Package peak temperature: 215 C, Time: 40 seconds max.
(at 200 C or higher), Count: Two times or less
Solder bath temperature: 260 C max., Time: 10 seconds max.,
Count: Once, Preheating temperature: 120 C max. (package surface
temperature)
Pin temperature: 350 C max., Time: 3 seconds max. (per pin row)
64-pin plastic LQFP (14
64-pin plastic LQFP (14
64-pin plastic LQFP (14
64-pin plastic LQFP (14
64-pin plastic LQFP (14
64-pin plastic QFP (14
User’s Manual U13029EJ7V1UD
Soldering Conditions
Soldering Conditions
14)
14)
14)
14)
14)
14)
14)
14)
14)
14)
14)
14)
IR35-00-3
VP15-00-3
WS60-00-1
IR35-00-2
VP15-00-2
WS60-00-1
Condition Symbol
Condition Symbol
Recommended
Recommended
––
––
399
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