STA333W13TR STMicroelectronics, STA333W13TR Datasheet - Page 44

• Manufacturer Part Number: STA333W13TR
• Description: IC DAS 2CH MICROLESS POWERSSO36
• Manufacturer: STMicroelectronics
• Series: Sound Terminal™r
• Type: Audio Processorr

Specifications of STA333W13TR

• Applications: DVD
• Mounting Type: Surface Mount
• Package / Case: 36-BFSOP (0.295", 7.50mm Width) Exposed Pad
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-11457-2

Package thermal characteristics
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Package thermal characteristics
A thermal resistance of 25 °C/W can be achieved by mounting the device on a PCB which
has two copper ground areas of 3 x 3 cm and 16 vias (see
Given that the amount of power dissipated within the device depends primarily on the supply
voltage, load impedance and output modulation level the maximum estimated dissipated
power for the STA333W is 3 W.
With the above suggested board as heatsink, a maximum junction temperature rise, ∆Tj, of
75 °C is possible. In consumer environments where 50 °C is the maximum ambient
temperature this provides some safety margin before the intervention of the thermal
protection (T
Figure 21. Double-layer PCB with two copper ground areas and 16 vias
Figure 22
copper areas of 2 x 2 cm
Figure 22. Power derating curve for PCB used as heatsink
Pd (W)
Pd (W)
shows the power derating curve for the PowerSSO-36 package on PCBs with
8
8
8
7
7
7
6
6
6
5
5
5
4
4
4
3
3
3
2
2
2
1
1
1
0
0
0
j
= 150 °C).
0
0
0
Copper Area 2x2 cm
Copper Area 2x2 cm
Copper Area 2x2 cm
and via holes
and via holes
and via holes
20
20
20
2
and 3 x 3 cm
Doc ID 13365 Rev 2
40
40
40
Copper Area 3x3 cm
Copper Area 3x3 cm
Copper Area 3x3 cm
and via holes
and via holes
and via holes
2
.
60
60
60
Tamb ( °C)
Tamb ( °C)
80
80
80
100
100
100
Figure
STA333W
PowerSSO-36
STA333W
STA333W
STA333W
PSSO36
PSSO36
PSSO36
21).
120
120
120
140
140
140
STA333W
160
160
160