BSS138BKS NXP Semiconductors, BSS138BKS Datasheet - Page 12

Dual N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology

BSS138BKS

Manufacturer Part Number
BSS138BKS
Description
Dual N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BSS138BKS
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
NXP Semiconductors
9. Package outline
Fig 18. Package outline SOT363 (TSSOP6)
BSS138BKS
Product data sheet
Plastic surface-mounted package; 6 leads
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT363
1.1
0.8
A
max
0.1
A 1
6
1
0.30
0.20
b p
y
IEC
pin 1
index
e 1
0.25
0.10
c
D
e
2
5
2.2
1.8
b p
D
All information provided in this document is subject to legal disclaimers.
JEDEC
1.35
1.15
E
4
3
REFERENCES
0
Rev. 1 — 12 August 2011
1.3
e
w
B
M
B
0.65
e
1
SC-88
JEITA
scale
1
H E
2.2
2.0
A
0.45
0.15
60 V, 320 mA dual N-channel Trench MOSFET
L p
A 1
2 mm
0.25
0.15
Q
H E
0.2
E
v
detail X
PROJECTION
0.2
EUROPEAN
w
L p
Q
BSS138BKS
0.1
y
A
c
© NXP B.V. 2011. All rights reserved.
X
v
ISSUE DATE
M
04-11-08
06-03-16
A
SOT363
12 of 17

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