STM8S103F3

Manufacturer Part NumberSTM8S103F3
DescriptionAccess line, 16 MHz STM8S 8-bit MCU, up to 8 Kbytes Flash, data EEPROM
ManufacturerSTMicroelectronics
STM8S103F3 datasheet
 

Specifications of STM8S103F3

Program Memory8 Kbytes Flash; data retention 20 years at 55 °C after 10 kcyclesData Memory640 bytes true data EEPROM; endurance 300 kcycles
Ram1 KbytesAdvanced Control Timer16-bit, 4 CAPCOM channels, 3 complementary outputs, dead-time insertion and flexible synchronization
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Page 100/113

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Thermal characteristics
12
Thermal characteristics
The maximum chip junction temperature (T
Operating
conditions.
The maximum chip-junction temperature, T
the following equation:
T
= T
+ (P
Jmax
Amax
Where:
T
is the maximum ambient temperature in °C
Amax
Θ
is the package junction-to-ambient thermal resistance in °C/W
JA
P
is the sum of P
Dmax
P
is the product of I
INTmax
power.
P
represents the maximum power dissipation on output pins
I/Omax
Where: P
I/Omax
V
/I
of the I/Os at low and high level in the application.
OH
OH
Symbol
Parameter
Θ
Thermal resistance junction-ambient
JA
TSSOP20 - 4.4 mm
Θ
Thermal resistance junction-ambient
JA
SO20W (300 mils)
Θ
Thermal resistance junction-ambient
JA
UFQFPN20 - 3 x 3 mm
Θ
Thermal resistance junction-ambient
JA
LQFP32 - 7 x 7 mm
Θ
Thermal resistance junction-ambient
JA
UFQFPN32 - 5 x 5 mm
(1)
Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural
convection environment.
100/113
) must never exceed the values given in
J max
, in degrees Celsius, may be calculated using
Jmax
x Θ
)
Dmax
JA
and P
(PDmax = P
INTmax
I/Omax
andV
, expressed in Watts. This is the maximum chip internal
DD
DD
=Σ (V
*I
) + Σ((V
-V
)*I
OL
OL
DD
OH
OH
Table 57: Thermal characteristics
(1)
DocID15441 Rev 7
STM8S103K3 STM8S103F3 STM8S103F2
+ P
)
INTmax
I/Omax
), taking into account the actual V
Value
84
91
90
60
38
/I
OL
OL and
Unit
°C/W
°C/W
°C/W
°C/W
°C/W