ST72254G2-Auto STMicroelectronics, ST72254G2-Auto Datasheet - Page 134

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ST72254G2-Auto

Manufacturer Part Number
ST72254G2-Auto
Description
8-bit MCU for automotive with single voltage Flash/ROM memory, ADC, 16-bit timers, SPI, I2C interfaces
Manufacturer
STMicroelectronics
Datasheet

Specifications of ST72254G2-Auto

Clock Sources
crystal/ceramic resonator oscillators or RC oscillators, external clock, backup Clock Security System
3 Power Saving Modes
Halt, Wait and Slow
Two 16-bit Timers With
2 input captures, 2 output compares, external clock input on one timer, PWM and Pulse generator modes (one only on ST72104Gx-Auto and ST72216G1- Auto)
ST72104Gx-Auto, ST72215Gx-Auto, ST72216Gx-Auto, ST72254Gx-Auto
16 SUMMARY OF CHANGES
Description of the changes between the current release of the specification and the previous one.
134/135
29-Oct-2007
Date
Rev.
1
Initial release of the ST72104Gx-Auto, ST72215Gx-Auto, ST72216Gx-Auto, ST72254Gx-Auto
datasheet
The ST72xxxG-Auto datasheet was created from the ST72104G, ST72215G, ST72216G,
ST72254G Preliminary Data datasheet, revision 2.6 dated November 2000, with the following
changes:
Changed document title and description on
Removed SDIP32 package outline from
“Device Summary” on page
- changed operating temperature range
- removed SDIP32 package
Section 1 "INTRODUCTION" on page
paragraph
Section 2 "PIN DESCRIPTION" on page
Table 1 on page
Section 6 "SUPPLY, RESET AND CLOCK MANAGEMENT" on page
sion to ST72xxxG numbers in first paragraph
“MULTI-OSCILLATOR (MO)” on page
Section 11.1.3 "Functional Description" on page
ond paragraph to be in line with spec given in
page 119
Section 12.1.4 "Indexed (No Offset, Short, Long)" on page
ing mode consists of” with “The indexed addressing mode consists of” in second paragraph
Section 13.2.1 "Voltage Characteristics" on page
Section 13.3.1 "General Operating Conditions" on page
range conditions to include only automotive device suffix versions
Section 13.5.3.2 "Typical Ceramic Resonators" on page
ic Resonators for General Purpose Applications”
Changed titles of
Figure 91.SPI Slave Timing Diagram with CPHA=1
for SCK
Section 14.1 "PACKAGE MECHANICAL DATA" on page
- removed
- added
- removed
Section 14.3 "THERMAL CHARACTERISTICS" on page
from package thermal resistance ratings
Figure 97.ROM Factory Coded Device
perature versions and removed DIP package
Figure 98.Flash User Programmable Device
vice temperature versions and removed DIP package
Section 15.1 "OPTION BYTES" on page
“MICROCONTROLLER OPTION LIST” on page
vice temperature versions and removed DIP package
Section 15.3 "DEVELOPMENT TOOLS" on page
the end of the first paragraph
Table 26, “STMicroelectronics Tool Features,” on page
Section 15.3.1 "Package/Socket Footprint Proposal" on page
ed List of SDIP32 Socket Types”
Section 15.4 "ST7 APPLICATION NOTES" on page
Notes”
Updated disclaimer on last page to include a mention about the use of ST products in automo-
tive applications
INPUT
Section 14.2 "ECOPACK®" on page 128
Figure “32-Pin Shrink Plastic Dual In Line Package”
Section "SOLDERING AND GLUEABILITY INFORMATION"
8: Removed SDIP32 pin number column
Figure 81 on page 117
1:
6: Added ‘-Auto’ extension to ST72xxxG numbers in first
21: Modified description of external and internal RC
Types: Modified to include only automotive device tem-
Main changes
page 1
7: Removed
and
129: Changed description of FMP option bit
page 1
Types: Modified to include only automotive de-
Figure 84 on page 118
Section 13.9.1 "Asynchronous RESET Pin" on
39: Replaced 500ns with 30µs at end of sec-
131: Modified to include only automotive de-
96: Changed V
132: Removed link ‘http//mcu.st.com’ from
1): Corrected ‘CPHA=0’ to read ‘CPHA=1’
133: Removed
Figure "32-Pin SDIP Package Pinout"
132: Added footnote 2
106: Removed
97: Modified ambient temperature
128: Removed SDIP32 package
128:
90: Replaced “The indirect address-
133: Removed
IN
ratings and values
Table “ST7 Application
17: Added ‘-Auto’ exten-
Table “Typical Ceram-
Table “Suggest-

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