lh28f160bg-tl Sharp Microelectronics of the Americas, lh28f160bg-tl Datasheet - Page 6

no-image

lh28f160bg-tl

Manufacturer Part Number
lh28f160bg-tl
Description
M-bit Smart Flash Memories
Manufacturer
Sharp Microelectronics of the Americas
Datasheet
of status (versus software polling) and status
masking (interrupt masking for background block
erase, for example). Status polling using RY/BY#
minimizes both CPU overhead and system power
consumption. When low, RY/BY# indicates that the
WSM is performing a block erase or word write.
RY/BY#-High-impedance indicates that the WSM is
ready for a new command, block erase is
suspended (and word write is inactive), word write
is suspended, or the device is in deep power-down
mode.
The access time is 100 ns or 120 ns (t
V
temperature range, 0 to +70°C (LH28F160BG-TL)/
–25 to +85°C (LH28F160BGH-TL).
CC
supply voltage range of 2.7 to 3.6 V over the
AVQV
) at the
- 6 -
The Automatic Power Saving (APS) feature
substantially reduces active current when the
device is in static mode (addresses not switching).
In APS mode, the typical I
2.7 V V
When CE# and RP# pins are at V
CMOS standby mode is enabled. When the RP#
pin is at GND, deep power-down mode is enabled
which minimizes power consumption and provides
write protection during reset. A reset time (t
required from RP# switching high until outputs are
valid. Likewise, the device has a wake time (t
from RP#-high until writes to the CUI are
recognized. With RP# at GND, the WSM is reset
and the status register is cleared.
CC
.
LH28F160BG-TL/BGH-TL
CCR
current is 3 mA at
CC
, the I
PHQV
PHEL
) is
CC
)

Related parts for lh28f160bg-tl