PIC18F14K50-I/SS Microchip Technology, PIC18F14K50-I/SS Datasheet - Page 178

IC PIC MCU FLASH 8KX16 20-SSOP

PIC18F14K50-I/SS

Manufacturer Part Number
PIC18F14K50-I/SS
Description
IC PIC MCU FLASH 8KX16 20-SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr

Specifications of PIC18F14K50-I/SS

Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
20-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
14
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
16 bit
Data Ram Size
768 B
Interface Type
EUSART, I2C, MSSP, SPI, USB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
15
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
Package
20SSOP
Device Core
PIC
Family Name
PIC18
Maximum Speed
48 MHz
Operating Supply Voltage
3.3|5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC244023 - PROC EXTENS PAK PIC18F1XK50DV164126 - KIT DEVELOPMENT USB W/PICKIT 2DM164127 - KIT DEVELOPMENT USB 18F14/13K50AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPXLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPAC164307 - MODULE SKT FOR PM3 28SSOP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F14K50-I/SS
Manufacturer:
IR
Quantity:
14 500
Part Number:
PIC18F14K50-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC18F14K50-I/SS
0
PIC18F/LF1XK50
15.3.17.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user deasserts SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD and counts
down to 0. The SCL pin is then deasserted and when
sampled high, the SDA pin is sampled.
FIGURE 15-29:
FIGURE 15-30:
DS41350E-page 178
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
Preliminary
T
BRG
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’,
If SDA is sampled high, the BRG is reloaded and begins
counting. If SDA goes from high-to-low before the BRG
times out, no bus collision occurs because no two
masters can assert SDA at exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition,
see
If, at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is
complete.
Figure
15-30.
T
Cleared by software
 2010 Microchip Technology Inc.
BRG
Interrupt cleared
by software
‘0’
‘0’
‘0’
Figure
15-29).

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