PIC18F14K50-I/SS Microchip Technology, PIC18F14K50-I/SS Datasheet - Page 179

IC PIC MCU FLASH 8KX16 20-SSOP

PIC18F14K50-I/SS

Manufacturer Part Number
PIC18F14K50-I/SS
Description
IC PIC MCU FLASH 8KX16 20-SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr

Specifications of PIC18F14K50-I/SS

Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
20-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
14
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
16 bit
Data Ram Size
768 B
Interface Type
EUSART, I2C, MSSP, SPI, USB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
15
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
Package
20SSOP
Device Core
PIC
Family Name
PIC18
Maximum Speed
48 MHz
Operating Supply Voltage
3.3|5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC244023 - PROC EXTENS PAK PIC18F1XK50DV164126 - KIT DEVELOPMENT USB W/PICKIT 2DM164127 - KIT DEVELOPMENT USB 18F14/13K50AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPXLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPAC164307 - MODULE SKT FOR PM3 28SSOP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F14K50-I/SS
Manufacturer:
IR
Quantity:
14 500
Part Number:
PIC18F14K50-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC18F14K50-I/SS
0
15.3.17.3
Bus collision occurs during a Stop condition if:
a)
b)
FIGURE 15-31:
FIGURE 15-32:
 2010 Microchip Technology Inc.
After the SDA pin has been deasserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
After the SCL pin is deasserted, SCL is sampled
low before SDA goes high.
SDA
SCL
PEN
BCLIF
P
SSPIF
SDA
SCL
PEN
BCLIF
P
SSPIF
Bus Collision During a Stop
Condition
BUS COLLISION DURING A STOP CONDITION (CASE 1)
BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDA asserted low
Assert SDA
T
BRG
T
BRG
Preliminary
T
BRG
T
BRG
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD and
counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’
sampled low before SDA is allowed to float high, a bus
collision occurs. This is another case of another master
attempting to drive a data ‘0’
PIC18F/LF1XK50
SCL goes low before SDA goes high,
set BCLIF
T
BRG
T
BRG
(Figure
15-31). If the SCL pin is
(Figure
SDA sampled
low after T
set BCLIF
‘0’
‘0’
DS41350E-page 179
‘0’
‘0’
15-32).
BRG
,

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