PIC18F14K50-I/SS Microchip Technology, PIC18F14K50-I/SS Datasheet - Page 18

IC PIC MCU FLASH 8KX16 20-SSOP

PIC18F14K50-I/SS

Manufacturer Part Number
PIC18F14K50-I/SS
Description
IC PIC MCU FLASH 8KX16 20-SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr

Specifications of PIC18F14K50-I/SS

Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
20-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
14
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
16 bit
Data Ram Size
768 B
Interface Type
EUSART, I2C, MSSP, SPI, USB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
15
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
Package
20SSOP
Device Core
PIC
Family Name
PIC18
Maximum Speed
48 MHz
Operating Supply Voltage
3.3|5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC244023 - PROC EXTENS PAK PIC18F1XK50DV164126 - KIT DEVELOPMENT USB W/PICKIT 2DM164127 - KIT DEVELOPMENT USB 18F14/13K50AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPXLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPAC164307 - MODULE SKT FOR PM3 28SSOP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F14K50-I/SS
Manufacturer:
IR
Quantity:
14 500
Part Number:
PIC18F14K50-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC18F14K50-I/SS
0
PIC18F/LF1XK50
FIGURE 2-3:
2.3.3
The External Resistor-Capacitor (RC) mode supports
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required. In RC mode, the RC circuit connects to OSC1,
allowing OSC2 to be configured as an IO or as
CLKOUT. The CLKOUT function is selected by the
FOSC bits of the CONFIG1H Configuration register.
When OSC2 is configured as CLKOUT, the frequency
at the pin is the frequency of the RC oscillator divided by
4.
FIGURE 2-4:
DS41350E-page 18
R
C
Note 1: A series resistor (R
Note 1:
Figure 2-4
V
Recommended values: 10 k  R
EXT
EXT
SS
V
F
I/O
C1
C2 Ceramic
DD
OSC
2: The value of R
3: An additional parallel feedback resistor (R
(2)
2:
/4 or
Resonator
ceramic resonators with low drive level.
selected (typically between 2 M to 10 M.
may be required for proper ceramic resonator
operation.
EXTERNAL RC
shows the external RC mode connections.
Alternate pin functions are listed in
Section 1.0 “Device
Output depends upon RC or RCIO clock mode.
R
P
R
OSC1/CLKIN
OSC2/CLKOUT
(3)
S (1)
CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
EXTERNAL RC MODES
F
C
varies with the Oscillator mode
EXT
OSC1/CLKIN
OSC2/CLKOUT
> 20 pF
S
R
PIC
) may be required for
F
Overview”.
(2)
EXT
®
(1)
PIC
MCU
 100 k
®
MCU
To Internal
Logic
Sleep
Internal
Clock
Preliminary
P
)
The RC oscillator frequency is a function of the supply
voltage, the resistor REXT, the capacitor CEXT and the
operating temperature. Other factors affecting the
oscillator frequency are:
• Input threshold voltage variation
• Component tolerances
• Variation in capacitance due to packaging
2.3.4
The External Clock (EC) mode allows an externally
generated logic level clock to be used as the system’s
clock source. When operating in this mode, the
external clock source is connected to the OSC1
allowing OSC2 to be configured as an I/O or as
CLKOUT. The CLKOUT function is selected by the
FOSC bits of the CONFIG1H Configuration register.
When OSC2 is configured as CLKOUT, the frequency
at the pin is the frequency of the EC oscillator divided
by 4.
Three different power settings are available for EC
mode. The power settings allow for a reduced I
device, if the EC clock is known to be in a specific
range. If there is an expected range of frequencies for
the EC clock, select the power mode for the highest
frequency.
2.4
The Secondary External Oscillator is designed to drive
an external 32.768 kHz crystal. This oscillator is
enabled or disabled by the T1OSCEN bit of the T1CON
register. See
information.
EC
EC
EC
Secondary External Oscillator
Low power
Medium power 250 kHz – 4 MHz
High power
EXTERNAL CLOCK
Section 11.0 “Timer1 Module”
 2010 Microchip Technology Inc.
0 – 250 kHz
4 – 48 MHz
DD
for more
of the

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